Jiangsu Profile
Product List
15616. High Quality Sub Microfiber Lint Free Cloth for Semiconductor Industry Cleaning Cleanroom Wiper 
[Apr 03, 2026]
[Apr 03, 2026] Product Description Cleanroom Wipers Our cleanroom wipers are manufactured from premium polyester and microfiber materials, including polyester wipes, sub-microfiber wipes, microfiber wipes, and anti-static variants. ...
Company: KINGWAY CLEAN TECH CO., LTD.
15617. Factory Price Sub Microfiber Cloth for Semiconductor Low Lint Cleaning Use Cleanroom Wiper [Apr 03, 2026]
[Apr 03, 2026] Product Description Cleanroom Wipers Our cleanroom wipers are manufactured from premium polyester and microfiber materials, including polyester wipes, sub-microfiber wipes, microfiber wipes, and anti-static variants. ...
Company: KINGWAY CLEAN TECH CO., LTD.
15618. 5n High Purity Fused Silica Powder 99.999% Sio2, 1000 Mesh Ultra-Fine Fused Quartz Powder for ... [Mar 31, 2026]
[Mar 31, 2026] Company Profile Runlai Quartz Technology Since: 2018 Specialty: Mainly engaged in fire-resistant and wear-resistant materials such as fused quartz, quartz sand and quartz products. Capacity: 10,000 dresses/month ...
15619. High Precision Aluminum Sheet Stainless Steel Plate for Semiconductor Equipment [Mar 12, 2026]
[Mar 12, 2026] Product Description Product Stainless Stee Plate Surface Finish BA, 2B, 2D, 4K, 6K, 8K, NO.4, HL, Embossed Technique Hot Rolled / Cold Rolled Standard GB JIS ASTM ASME EN Steel Grade 200 series: 201 202 300 series: 301 ...
15620. Great Quality Semiconductor Specialty Gas Silane Sih4 Gas [Mar 05, 2026]
[Mar 05, 2026] Product Description Essential details CAS No.: Other Names: 7803-62-5 Silane MF: EINECS No.: SiH4 232-263-4 Place of Origin: Grade Standard: Jiangsu, China Industrial Grade, Electron ...
Company: Jiangsu Huazhong Gas Co., Ltd.
15621. Industrial Dispensing Automation Robot Used for Semiconductor Packaging/SMT Assembly [Feb 28, 2026]
[Feb 28, 2026] Product Description TSV-200D Desktop Vision Glue Dispensing Machine - Product Description Precision. Efficiency. Intelligence. The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya ...
15622. Advanced High-Speed Wire Bonding Machine for Semiconductor Manufacturing [Feb 28, 2026]
[Feb 28, 2026] High-Speed Automatic Lead Wire Bonding Machine Product Description 1.Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant ...
15623. Advanced Customized Flip Chip Die Bonder Machine for Semiconductor Solutions [Feb 28, 2026]
[Feb 28, 2026] High Quality Customized Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Technical Specifications: SHD8120 Die Bonder Parameter Category Specification ...
15624. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
15625. Fully Automatic IC Transfer Molding Equipment System Semiconductor Plastic Packaging Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Himalaya 002 Fully Automatic Semiconductor Molding Machine The Himalaya 002 is a state-of-the-art, fully automatic semiconductor molding machine engineered for high-precision, high-volume ...
15626. Advanced Precision Automatic Clip Chip Bonder for Semiconductor Production [Feb 28, 2026]
[Feb 28, 2026] Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or ...
15627. High Precision Automatic Die Bonding Machine for Semiconductors [Feb 28, 2026]
[Feb 28, 2026] High Precision Semiconductor manual COB Smart Die Bonding Machine Automatic Dispensing industrial equipment manufacturer Product Description High-Speed Clip Bonder & Die Attach System: A Unified Precision ...
15628. 6 Inch Wafer Ring Frame for Semiconductor SUS420J2 with Factory Direct Price [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
15629. 8-Inch SUS420J2 Wafer Dicing Frame for Semiconductor Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
15630. Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Die Bonding Machine System manufacturer Product Description Revolutionize Your Production with the SD800 Fully Automatic Die Bonding Machine In the fast-paced world of semiconductor manufacturing, ...
