Jiangsu Profile
Product List
15151. Customized Semiconductor Silicon Carbide Ceramic Wafer Carrier Sic Boat for Lpcvd Process 
[Sep 24, 2026]
[Sep 24, 2026] Product Description Customized High Purity Silicon Carbide Wafer Boat SiC Ceramic Wafer Carrier for LPCVD Semiconductor Process silicon carbide wafer boat SiC wafer carrier LPCVD ceramic boat semiconductor wafer carrier ...
15152. Jsa025cp0 Jsa025XP0 American Thin-Wall Bearing Jsa025cpo Jsa025xpo Robot Semiconductor Bearings [Sep 24, 2026]
[Sep 24, 2026] JSA025CP0 JSA025XP0 American Thin-wall Bearing JSA025CPO JSA025XPO Robot Semiconductor Bearings Product Description 1. Type: thin section bearing 2. Specification: Part number JSA025XPO Bore diameter 63.5 ...
Company: WUXI AMC POWER MACHINERY CO., LTD.
15153. Advanced Low Point Dehumidifier for Semiconductor Cleanroom Efficiency [Oct 14, 2026]
[Oct 14, 2026] Specification Unit Parameter Table (Non - standard customization can be carried out according to actual working conditions, for reference only) Product model SJD120-50000Z-H1 Treatment air System rated air volume(m³/h) ...
Company: Jiangsu Sujing Group Co., Ltd.
15154. High Purity PVDF Rod for Semiconductor Wafer Carriers [Sep 23, 2026]
[Sep 23, 2026] Product Description Characteristics Item Unit Test method ASTM PVDF Mechanical properties Tensile strength MPa D638 50 Tensile elongation % D638 ≥50 Tensile Modulus Mpa ISO 527-2 2000 Flexural Modulus Mpa ISO 178 2000 ...
15155. Infrared Picosecond Scribe & Break Machine for Quartz and Semiconductor Glass [Sep 23, 2026]
[Sep 23, 2026] GLASS LASER SCRIBE & BREAK INTEGRATED MACHINE Chanxan specializes in high-precision machining of glass, ceramics, semiconductors and other brittle materials. We deliver high-efficiency, high-precision ultrafast laser ...
15156. Advanced High-Speed Wire Bonding Machine for Semiconductor Manufacturing [Sep 23, 2026]
[Sep 23, 2026] High-Speed Automatic Lead Wire Bonding Machine Product Description 1.Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant ...
15157. High-Precision Flip Chip Die Bonder for Semiconductor Manufacturing [Sep 23, 2026]
[Sep 23, 2026] High Quality Customized Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Technical Specifications: SHD8120 Die Bonder Parameter Category Specification ...
15158. Pei Sheet for Semiconductor Wafer Handling Ultra Clean Plate [Sep 22, 2026]
[Sep 22, 2026] Product Description Characteristics Item Unit Test method ASTM PEI Mechanical properties Tensile strength MPa ISO 527-2 105 Elongation at break % ISO 527-2 60 Tensile Modulus Mpa ISO 527-2 3200 Shore Hardness — DIN ...
15159. High Rigidity PPS Sheet for Semiconductor Fixtures [Sep 22, 2026]
[Sep 22, 2026] Product Description Characteristics Item Unit Test method ASTM PPS Mechanical properties Tensile strength MPa ISO 527-2 72 Tensile elongation % ISO 527-2 21 Tensile Modulus Mpa ISO 527-2 75 Flexural Modulus Mpa ISO 178 ...
15160. High Purity Ffkm Seal for Semiconductor Plasma Etching Equipment [Oct 12, 2026]
[Oct 12, 2026] Parameter Table Place of origin Jiangsu Harbours Nanjing Quality Top Quality Transport packaging Packed in Plastic Bag Jiangsu Fuyuan New Material Co., Ltd. was established in 2016, located in Nanjing, the ancient ...
15161. Virgin PVDF Sheet for Chemical & Semiconductor Equipment [Sep 21, 2026]
[Sep 21, 2026] Product Description Characteristics Item Unit Test method ASTM PVDF Mechanical properties Tensile strength MPa D638 50 Tensile elongation % D638 ≥50 Tensile Modulus Mpa ISO 527-2 2000 Flexural Modulus Mpa ISO 178 2000 ...
15162. PVDF Sheet for Semiconductor Wafer Handling Ultra Pure Plate [Sep 21, 2026]
[Sep 21, 2026] Product Description Characteristics Item Unit Test method ASTM PVDF Mechanical properties Tensile strength MPa D638 50 Tensile elongation % D638 ≥50 Tensile Modulus Mpa ISO 527-2 2000 Flexural Modulus Mpa ISO 178 2000 ...
15163. High Purity Peek Bar for Semiconductor Equipment Components [Sep 21, 2026]
[Sep 21, 2026] Product Description Characteristics Item Unit Test method ASTM PEEK 770G Mechanical properties Tensile strength MPa D638 98 Tensile elongation % D638 45 Tensile Modulus Mpa ISO 527-2 3700 Flexural Strength MPa IS0 178 ...
15164. Semiconductor Grade Peek Rod for Wafer Processing [Sep 20, 2026]
[Sep 20, 2026] Product Description Characteristics Item Unit Test method ASTM PEEK 770G Mechanical properties Tensile strength MPa D638 98 Tensile elongation % D638 45 Tensile Modulus Mpa ISO 527-2 3700 Flexural Strength MPa IS0 178 ...
15165. Semiconductor Grade Peek Sheet for Wafer Processing [Sep 20, 2026]
[Sep 20, 2026] Product Description Characteristics Item Unit Test method ASTM PEEK 770G Mechanical properties Tensile strength MPa D638 98 Tensile elongation % D638 45 Tensile Modulus Mpa ISO 527-2 3700 Flexural Strength MPa IS0 178 ...
