Jiangsu Profile
Product List
15181. High-Precision Semiconductor Wafer Bonder for Advanced Die Bonding 
[Sep 28, 2026]
[Sep 28, 2026] Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip size 0.2mmx0.2mm~2.3mmx2.3mm ...
15182. Deep Pleat HEPA Filter for Cleanroom Semiconductor Facilities Demanding Maximum Dust Control and ... [Oct 17, 2026]
[Oct 17, 2026] Product Name Deep pleat HEPA filter for cleanroom semiconductor facilities demanding maximum dust control and stable operation Supplier Nantong Lyusen Environmental Protection Purification Material Co., Ltd. ...
Company: Nantong Lyusen Environmental Protection Purification Material Co., Ltd
15183. Mini Pleat HEPA Filter for Cleanroom Applications in Semiconductor and Electronics Assembly Lines [Oct 17, 2026]
[Oct 17, 2026] Product Name Mini Pleat HEPA Filter for Cleanroom Applications in Semiconductor and Electronics Assembly Lines Supplier Nantong Lyusen Environmental Protection Purification Material Co., Ltd. Specification ...
Company: Nantong Lyusen Environmental Protection Purification Material Co., Ltd
15184. Customized Compact V Type HEPA Filter for Semiconductor Factory Air Handling Purification Equipment [Oct 17, 2026]
[Oct 17, 2026] Product Name Customized Compact V Type HEPA Filter for Semiconductor Factory Air Handling Purification Equipment Supplier Nantong Lyusen Environmental Protection Purification Material Co., Ltd. Specification ...
Company: Nantong Lyusen Environmental Protection Purification Material Co., Ltd
15185. Factory Direct Bw-8040xfr Industrial Grade Tfc Membrane 8500 Gpd 99.7% for Semiconductor Wastewater [Oct 20, 2026]
[Oct 20, 2026] Designed for challenging feedwater conditions, BW-8040XFR RO elements offer high-performance water treatment for industrial and commercial applications. Built with advanced anti-fouling polyamide TFC flatsheets, ...
Company: SuZhou NANOVELA Technology Co., Ltd.
15186. Anti Static UHMWPE Sheet for Semiconductor Cleanroom [Sep 23, 2026]
[Sep 23, 2026] Product Description Characteristics Item Unit Test method ASTM UHMW-PE Mechanical properties Tensile strength MPa D638 17 Tensile elongation % D638 ≥50 Tensile Modulus Mpa ISO 527-2 650 Flexural Modulus Mpa ISO 178 800 ...
15187. PTFE Rod for Semiconductor Wafer Handling Equipment [Sep 23, 2026]
[Sep 23, 2026] Product Description Characteristics Item Unit Test method ASTM PTFE Mechanical properties Tensile strength MPa D638 25 Tensile elongation % D638 > 5 Tensile Modulus Mpa ISO 527-2 700 Shore Hardness — DIN 53505 55-60 ...
15188. High Purity PTFE Plate for Semiconductor Wet Bench [Sep 23, 2026]
[Sep 23, 2026] Product Description Characteristics Item Unit Test method ASTM PTFE Mechanical properties Tensile strength MPa D638 25 Tensile elongation % D638 > 5 Tensile Modulus Mpa ISO 527-2 700 Shore Hardness — DIN 53505 55-60 ...
15189. High Purity PTFE Bar for Semiconductor Wet Bench [Sep 23, 2026]
[Sep 23, 2026] Product Description Characteristics Item Unit Test method ASTM PTFE Mechanical properties Tensile strength MPa D638 25 Tensile elongation % D638 > 5 Tensile Modulus Mpa ISO 527-2 700 Shore Hardness — DIN 53505 55-60 ...
15190. High Purity PTFE Sheet for Semiconductor Wet Bench [Sep 22, 2026]
[Sep 22, 2026] Product Description Characteristics Item Unit Test method ASTM PTFE Mechanical properties Tensile strength MPa D638 25 Tensile elongation % D638 > 5 Tensile Modulus Mpa ISO 527-2 700 Shore Hardness — DIN 53505 55-60 ...
15191. Pure Pi 7380 Sheet for Semiconductor Wafer Handling [Sep 22, 2026]
[Sep 22, 2026] Product Description Characteristics Item Unit Test method ASTM Polyimide Mechanical properties Tensile strength MPa D638 86 Tensile elongation % D638 7.5 Tensile Modulus Mpa ISO 527-2 3275 Flexural Modulus Mpa ISO 178 ...
15192. Cy-C Series EDM Wire Cutting Machine for Semiconductor Manufacturing [Sep 22, 2026]
[Sep 22, 2026] Product Description The body of the machine is made of high rigidity HT250. The machine has high rigidity and good stability for quality material. Screw use the high precision ball screw , high operation accuracy. Guide ...
15193. Low Outgassing Polyimide Rod for Semiconductor Vacuum [Sep 21, 2026]
[Sep 21, 2026] Product Description Characteristics Item Unit Test method ASTM Polyimide Mechanical properties Tensile strength MPa D638 86 Tensile elongation % D638 7.5 Tensile Modulus Mpa ISO 527-2 3275 Flexural Modulus Mpa ISO 178 ...
15194. Chemical Resistant Polyimide Sheet for Semiconductor Equipment [Sep 21, 2026]
[Sep 21, 2026] Product Description Characteristics Item Unit Test method ASTM Polyimide Mechanical properties Tensile strength MPa D638 86 Tensile elongation % D638 7.5 Tensile Modulus Mpa ISO 527-2 3275 Flexural Modulus Mpa ISO 178 ...
15195. High Strength ETFE Release Film for Semiconductor LED Packaging [Sep 20, 2026]
[Sep 20, 2026] Parameter Table Place of origin Jiangsu Harbours Nanjing Quality Top Quality Transport packaging Packed in Plastic Bag Jiangsu Fuyuan New Material Co., Ltd. was established in 2016, located in Nanjing, the ancient ...
