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Product List
70906. Microchip DSPIC33CH512MP508T-E/PTVAO 3V~3.6V, 180MHz, 200MHz, 64KB FLASH, PRAM 584KB 
[Oct 25, 2026]
[Oct 25, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70907. isc STF8N80K5 30V, 2 N-Channel, 800V, 6A4.7nF, TO-220F [Nov 08, 2026]
[Nov 08, 2026] Features w figure-of-merit (FOM) Ron x Qg •Low input capacitance (Ciss) •Reduced switching and conduction losses •Ultra low gate charge (Qg) •Avalanche energy rated (UIS) APPLIC Application • Server and telecom power ...
Company: BNSENS Co., Ltd.
70908. Microchip DSPIC33EP128MC502-I/MM 3V~3.6V 816KB FLASH 128KB Brown-out Detect/Reset [Oct 20, 2026]
[Oct 20, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +85°C, DC to 70 MIPS • 3.0V to 3.6V, -40°C to +125°C, DC to 60 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 40 MIPS Core: 16-Bit dsPIC33E/PIC24E CPU • Code Efficient (C and ...
Company: BNSENS Co., Ltd.
70909. Xilinx XC7A35T-2CSG324I 225KB, 33280, 2600, 950mV, 1.05V, CSPBGA-324, SMD [Nov 08, 2026]
[Nov 08, 2026] Overview The purpose of this notification is to communicate that Xilinx® has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale™, ...
Company: BNSENS Co., Ltd.
70910. AMD XC7A35T-1FTG256 225KB 33280 2600 950mV 1.05V FTBGA-256 [Nov 08, 2026]
[Nov 08, 2026] Overview The purpose of this notification is to communicate that Xilinx® has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale™, ...
Company: BNSENS Co., Ltd.
70911. AMD XC7A50T-2CSG325I 800MHz 256KB SRAM DMA 130 2 950mV 1.05V 1GHz [Nov 08, 2026]
[Nov 08, 2026] Overview The purpose of this notification is to communicate that Xilinx® has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale™, ...
Company: BNSENS Co., Ltd.
70912. Microchip DSPIC33CK128MP505T-E/PTVAO dsPIC33C 100MHz, 128K Dual Panel Flash, 16K RAM [Oct 22, 2026]
[Oct 22, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70913. Microchip DSPIC33FJ16GS502-E/MM Microchip ALU DSP Chip, dsPIC Series, 28-Pin, QFN Package [Nov 03, 2026]
[Nov 03, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70914. Microchip DSPIC33CK128MP505-E/PTVAO MCU 16-bit dsPIC CISC 128KB Flash 3.3V 48-Pin TQFP Tray [Nov 03, 2026]
[Nov 03, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70915. Microchip MIC5233-5.0YM5-TRVAO Fixed 100mA, 1.5V~36V,SOT-23-5, SMD mounting [Nov 02, 2026]
[Nov 02, 2026] Features • AEC-Q100 Qualified and PPAP Capable; Available for 5-Lead SOT23 Package Only • Wide Input Voltage Range: 2.3V to 36V • Ultra-Low Ground Current: 18 µA • Low Dropout Voltage of 270 mV at 100 mA • High Output ...
Company: BNSENS Co., Ltd.
70916. Premium Oak Cork Granules for Superior Cushioning Solutions [Oct 29, 2026]
[Oct 29, 2026] Products Name Granulated Cork Specification Granule Size: 4-6mm, 6-8mm, 8-12mm Density: 65-130kg/m3 Usage Cork granules can be used to make composite cork products, sports field infill, a soil conditioner, ...
70917. Xilinx XC7A100T-2FGG484I 607.5KB, 101440, 7925, 950mV, 1.05V, BGA, FBGA, surface mount [Nov 06, 2026]
[Nov 06, 2026] Overview The purpose of this notification is to communicate that Xilinx® has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale™, ...
Company: BNSENS Co., Ltd.
70918. Microchip DSPIC33FJ256GP710A-I/PF Microchip fixed-point & floating-point DSP [Oct 16, 2026]
[Oct 16, 2026] Operating Conditions • 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS • 3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS Core: 16-bit dsPIC33F CPU • Code-efficient (C and Assembly) architecture • Two 40-bit wide accumulators ...
Company: BNSENS Co., Ltd.
70919. Hot Sale Tumbler Dryer Parts Repair for Knit Wears Rubber Parts Dryer Machines [Oct 15, 2026]
[Oct 15, 2026] Hot sale tumbler dryer parts repair for knit wears Rubber parts Dryer machines Features and Benefits: 1. High speed drying within 60-90 minutes for major gloves* 2. Designed for installation inside clean room ...
70920. Laundry 150kg New Rotary Drum Match with Washing Machine Dryer Rubber Parts Vulcanization Tumbler ... [Oct 15, 2026]
[Oct 15, 2026] laundry 150kg new rotary drum match with washing machine dryer Rubber Parts Vulcanization Tumbler Dryer machine Features and Benefits: 1. High speed drying within 60-90 minutes for major gloves* 2. Designed for ...
