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Product List
70891. Microchip DSPIC30F2010-30I/SP DSP chip, dsPIC30F series, 28-pin, SPDIP package 
[Oct 25, 2026]
[Oct 25, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70892. Microchip DSPIC33CK64MC105T-E/PTVAO 3V~3.6V, 180MHz, 200MHz, 64KB FLASH, PRAM 584KB [Oct 25, 2026]
[Oct 25, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70893. Microchip DSPIC33CK128MP206-E/PTVAO 3V~3.6V, 180MHz, 200MHz, 64KB FLASH, PRAM 584KB [Oct 25, 2026]
[Oct 25, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70894. Microchip DSPIC33CH512MP508T-E/PTVAO 3V~3.6V, 180MHz, 200MHz, 64KB FLASH, PRAM 584KB [Oct 25, 2026]
[Oct 25, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70895. isc STF8N80K5 30V, 2 N-Channel, 800V, 6A4.7nF, TO-220F [Nov 08, 2026]
[Nov 08, 2026] Features w figure-of-merit (FOM) Ron x Qg •Low input capacitance (Ciss) •Reduced switching and conduction losses •Ultra low gate charge (Qg) •Avalanche energy rated (UIS) APPLIC Application • Server and telecom power ...
Company: BNSENS Co., Ltd.
70896. Microchip DSPIC33EP128MC502-I/MM 3V~3.6V 816KB FLASH 128KB Brown-out Detect/Reset [Oct 20, 2026]
[Oct 20, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +85°C, DC to 70 MIPS • 3.0V to 3.6V, -40°C to +125°C, DC to 60 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 40 MIPS Core: 16-Bit dsPIC33E/PIC24E CPU • Code Efficient (C and ...
Company: BNSENS Co., Ltd.
70897. Xilinx XC7A35T-2CSG324I 225KB, 33280, 2600, 950mV, 1.05V, CSPBGA-324, SMD [Nov 08, 2026]
[Nov 08, 2026] Overview The purpose of this notification is to communicate that Xilinx® has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale™, ...
Company: BNSENS Co., Ltd.
70898. AMD XC7A35T-1FTG256 225KB 33280 2600 950mV 1.05V FTBGA-256 [Nov 08, 2026]
[Nov 08, 2026] Overview The purpose of this notification is to communicate that Xilinx® has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale™, ...
Company: BNSENS Co., Ltd.
70899. AMD XC7A50T-2CSG325I 800MHz 256KB SRAM DMA 130 2 950mV 1.05V 1GHz [Nov 08, 2026]
[Nov 08, 2026] Overview The purpose of this notification is to communicate that Xilinx® has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale™, ...
Company: BNSENS Co., Ltd.
70900. Microchip DSPIC33CK128MP505T-E/PTVAO dsPIC33C 100MHz, 128K Dual Panel Flash, 16K RAM [Oct 22, 2026]
[Oct 22, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70901. Microchip DSPIC33FJ16GS502-E/MM Microchip ALU DSP Chip, dsPIC Series, 28-Pin, QFN Package [Nov 03, 2026]
[Nov 03, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70902. Microchip DSPIC33CK128MP505-E/PTVAO MCU 16-bit dsPIC CISC 128KB Flash 3.3V 48-Pin TQFP Tray [Nov 03, 2026]
[Nov 03, 2026] Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle ...
Company: BNSENS Co., Ltd.
70903. Microchip MIC5233-5.0YM5-TRVAO Fixed 100mA, 1.5V~36V,SOT-23-5, SMD mounting [Nov 02, 2026]
[Nov 02, 2026] Features • AEC-Q100 Qualified and PPAP Capable; Available for 5-Lead SOT23 Package Only • Wide Input Voltage Range: 2.3V to 36V • Ultra-Low Ground Current: 18 µA • Low Dropout Voltage of 270 mV at 100 mA • High Output ...
Company: BNSENS Co., Ltd.
70904. Premium Oak Cork Granules for Superior Cushioning Solutions [Oct 29, 2026]
[Oct 29, 2026] Products Name Granulated Cork Specification Granule Size: 4-6mm, 6-8mm, 8-12mm Density: 65-130kg/m3 Usage Cork granules can be used to make composite cork products, sports field infill, a soil conditioner, ...
70905. Xilinx XC7A100T-2FGG484I 607.5KB, 101440, 7925, 950mV, 1.05V, BGA, FBGA, surface mount [Nov 06, 2026]
[Nov 06, 2026] Overview The purpose of this notification is to communicate that Xilinx® has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale™, ...
Company: BNSENS Co., Ltd.
