Jiangsu Profile
Product List
18751. Vertical Automatic Pouch Small Milk Coffee Powder Sachet Tea Bag Packing Machine 
[Dec 16, 2025]
[Dec 16, 2025] Product Description The particle powder packaging machine uses high-quality materials and components to ensure the durability and stability of the equipment. At the same time, its strict quality control system ensures ...
Company: Miluo Frank Technology Co.,Ltd.
18752. Advanced Automatic Laser Drilling Machine for Glass and Ceramics [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...
18753. Advanced High-Precision Automated Die Bonder for Multi-Chip Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description Our high-precision, multi-chip, automated die bonding system designed for advanced semiconductor and microelectronic assembly. It is engineered for flexibility, handling a wide variety of chip ...
18754. Advanced Plasma Cleaner for Efficient Wafer Photoresist Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
18755. Advanced Bsi-CCD Wafer Laser Annealing Equipment for Precision Energy Control [Dec 13, 2025]
[Dec 13, 2025] Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with ...
18756. 6 Inch Wafer Ring Frame for Semiconductor SUS420J2 with Factory Direct Price [Dec 13, 2025]
[Dec 13, 2025] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
18757. Premium Fmj Series High-Temperature Furnace for Industrial Applications [Dec 13, 2025]
[Dec 13, 2025] High Quality Fmj Series High-Temperature Box Sintering Furnace Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation ...
18758. High Precision Die Bonding Machine for PCB and IC Assembly [Dec 13, 2025]
[Dec 13, 2025] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
18759. High-Precision CCD Wafer Splitting Machine for Sic Semiconductor Chips [Dec 13, 2025]
[Dec 13, 2025] Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...
18760. Dry-in/Dry-out (DIDO) Process Chemical Mechanical Polishing Machine System for Wafer Polishing [Dec 13, 2025]
[Dec 13, 2025] Product Description Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability Support the flattening process requirements of SiC, GaN third-generation ...
18761. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
18762. Advanced Plasma Asher for Efficient Wafer Glue Removal [Dec 13, 2025]
[Dec 13, 2025] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
18763. Manual Semi Automatic Aluminum or Gold Desktop Wire Bonders with Factory Price [Dec 13, 2025]
[Dec 13, 2025] Product Description Himalaya DS Series Manual Desktop Wire Bonder The Himalaya DS Series of manual desktop wire bonders provides a versatile and cost-effective solution for precision interconnection tasks. Engineered ...
18764. High End Stable Operations and Profitable Returns Lithography Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description 1900 Series Advanced Lithography Equipment - Overview The 1900 Series is a high-end lithography system designed for advanced semiconductor process production. It is currently installed and in a ...
18765. Laser Trimming System Machine for Semiconductor Wafer Trimming Thick/Thin-Film Resistors [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
