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More Design Perforated Gypsum Ceiling Board 4X8FT
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18736.

More Design Perforated Gypsum Ceiling Board 4X8FT Open Details in New Window [Mar 24, 2026]

Degotone ® gypsum acoustic solutions, Standard Options perforated plasterboard contributes to aesthetics andexcellent acoustics. The range features three contemporary perforation patterns, each with different per ...

Company: Jiangyin Dego Building Materials Co., Ltd.

Available Customized Self-Adhesive Label, Brand Logo, Qr Code Transparent PVC Seal Stickers
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18737.

Available Customized Self-Adhesive Label, Brand Logo, Qr Code Transparent PVC Seal Stickers Open Details in New Window [Mar 05, 2026]

Factory price and perfect appearance custom product label Product Information: Item: customized self adhesive label Dimension: As per requirements from customer Print Tech: Letterpress Machine, Full-auto Rotary ...

Company: Jiangsu Itech Packaging Printing Co., Ltd.

New Technology Txj1000 Concentric Stranding Machine for Manufacturing Aluminium Stranded Conductors
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18738.

New Technology Txj1000 Concentric Stranding Machine for Manufacturing Aluminium Stranded Conductors Open Details in New Window [Mar 02, 2026]

Product Introduction CONCENTRIC STRANDING LINE for manufacturing ACSR, copper and aluminium stranded conductors The concentric stranding machine is designed specifically for no-back-twist stranding and pressing of ...

Company: Wuxi Hengtai Cable Machinery Manufacture Co., Ltd.

High-Performance Vertical Furnace for Sic and Pi Coatings
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18739.

High-Performance Vertical Furnace for Sic and Pi Coatings Open Details in New Window [Mar 02, 2026]

Fully Automatic Sic/Pi Composite Film Coating Vertical Furnace equipment manufacturer Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Marking Machine for BGA and LGA Components
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18740.

High-Precision Laser Marking Machine for BGA and LGA Components Open Details in New Window [Mar 02, 2026]

High-Precision Automatic BGA/LGA/SIP Substrate Laser Marking Machine Product Description Product Features Flexible configuration of fiber lasers, green lasers, UV lasers, etc. High-precision digital scanning ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Laser Debonding Technology for Rapid Industrial Solutions
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18741.

Advanced Laser Debonding Technology for Rapid Industrial Solutions Open Details in New Window [Mar 02, 2026]

Automatic Compensation Laser Debonding/Stripping Machine with Real-Time Monitoring Product Description Product Features Laser debonding, stripping and cleaning functions Square top hat beam, benefits high debonding ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Sheet Metal Fabrication Stamping Part for SUS/Aluminium Material
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18742.

High Precision Sheet Metal Fabrication Stamping Part for SUS/Aluminium Material Open Details in New Window [Mar 03, 2026]

PRODUCT PARAMETERS. Precision sheet metal & stamping fabrication: specializing in custom sheet metal componentsand precision stamping parts. Utilizing laser cutting, CNC punching, and precision bendingtechnologies, we ...

Company: Wuxi Gelanten Technology Co., Ltd.

Advanced Electroplating Cleaning Machine for Precision Metal Finishing
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18743.

Advanced Electroplating Cleaning Machine for Precision Metal Finishing Open Details in New Window [Feb 28, 2026]

High-Quality Electroplating Cleaning Machine for Electroplating, Plating, Oxidation, Etching and Cleaning Product Description 1,Scope of application Small integrated wastewater treatment equipment, small integrated ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Performance Sic Laser Annealing System for Wafer Efficiency
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18744.

High-Performance Sic Laser Annealing System for Wafer Efficiency Open Details in New Window [Feb 28, 2026]

Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System
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18745.

Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System Open Details in New Window [Feb 28, 2026]

Small Versatile Lithography Product Equipped With MLC600 Maskless Lithography System Product Description Measurement Precision: Current Range Precision Voltage Range Precision 10nA ±(1% + 0.04% FS + ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Single Mode Alignment System
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18746.

High Precision Single Mode Alignment System Open Details in New Window [Feb 28, 2026]

Product Description High-Precision Single-Mode Alignment System Core Functionality An active/passive alignment system designed for sub-micron positional accuracy (typically <0.1 &micro;m) to maximize coupling ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Tgv High Yield Precision Cutting Laser Drilling Equipment
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18747.

Tgv High Yield Precision Cutting Laser Drilling Equipment Open Details in New Window [Feb 28, 2026]

Tgv High Yield Precision Cutting Laser Drilling Equipment Product Description TGV High Yield Precision Cutting Laser Drilling Equipment Product Overview This TGV (Through Glass Via) laser drilling equipment is ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Sic Wafer GaN Substrates Chemical Mechanical Polishing Equipment
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18748.

Sic Wafer GaN Substrates Chemical Mechanical Polishing Equipment Open Details in New Window [Feb 28, 2026]

Product Description Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry
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18749.

High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry Open Details in New Window [Feb 28, 2026]

Product Description Wafer Handling and Marking System - Technical Overview Key Features Wafer Compatibility Supports 8-12 inch bare wafers (configurable for 2-12 inches via modular options). Adaptable to ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Qt-8200 Mixed Signal Tester for Precision Measurements
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18750.

Advanced Qt-8200 Mixed Signal Tester for Precision Measurements Open Details in New Window [Feb 28, 2026]

Product Description QT-8200 Mixed Signal IC Test System (Hard-Docking) Product description: Application scope: power management; digital consumer; audio; automotive, energy saving and environmental friendly electronics; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.