Jiangsu Profile
Product List
18556. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot 
[Feb 28, 2026]
[Feb 28, 2026] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
18557. Advanced Sic Laser Annealing Equipment for Industrial Solutions [Feb 28, 2026]
[Feb 28, 2026] 6 Inch 8 Inch Sic Laser Annealing Machine Sic Laser Annealing Equipment with Fully Autonomous Optical System Product Description Product Features First domestic green laser machine for mass pruduction High ...
18558. Advanced Picosecond Laser Glass Cutter for Precision Efficiency [Feb 28, 2026]
[Feb 28, 2026] High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...
18559. 6 Inch Wafer Ring Frame for Semiconductor SUS420J2 with Factory Direct Price [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
18560. Advanced Stealth Dicing Machine Solutions for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide materials. ...
18561. Precision Laser Cutting Equipment for Superior Grooving Performance [Feb 28, 2026]
[Feb 28, 2026] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with special customized laser head, which ensures high cutting quality and low heat ...
18562. Advanced High-Precision Automated Die Bonder for Multi-Chip Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Our high-precision, multi-chip, automated die bonding system designed for advanced semiconductor and microelectronic assembly. It is engineered for flexibility, handling a wide variety of chip ...
18563. 8-Inch SUS420J2 Wafer Dicing Frame for Semiconductor Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
18564. Silicon Sapphire LED Solar Wafer Laser Stealth Dicing Equipment with Dry Process [Feb 28, 2026]
[Feb 28, 2026] Product Description This laser wafer modification stealth dicing equipment is designed for silicon wafers, silicon carbide (SiC) wafers, LED sapphire wafers, and solar-related semiconductor wafers, supporting ...
18565. Advanced UV Laser Annealing Equipment for Bsi CCD Fabrication [Feb 28, 2026]
[Feb 28, 2026] Sic UV Laser Annealing Machine for Bsi-CCD Wafer Precise Energy Density Control Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly ...
18566. Advanced Plasma Asher for Efficient Wafer Adhesive Removal Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
18567. High-Precision Gantry Wire Bonder Machine for Diverse Industrial Uses [Feb 28, 2026]
[Feb 28, 2026] Product Description Our high-performance, fully automated wire bonder designed for a wide range of interconnection applications in semiconductor packaging. It is built with a robust long gantry XY system to ...
18568. Advanced Low-K Wafer Laser Grooving System with Auto Width Control [Feb 28, 2026]
[Feb 28, 2026] High Quality Low-K Wafer Laser Grooving Equipment with Automatic Adjustment of Grooving Width Product Description Product Features 8/12 inch compatible Ultra-fast UV picro-second laser. Excellent process ...
18569. Advanced Fmj Series Industrial Furnace for High-Temperature Applications [Feb 28, 2026]
[Feb 28, 2026] High Quality Fmj Series High-Temperature Box Sintering Furnace Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation ...
18570. High-Precision Automatic Laser Engraver for Custom Car Labels [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Provide customized and fully automated solutions Customized control software based on customer application scenarios Provide cost-effective equipment ...
