Jiangsu Profile
Product List
20806. Precision Laser Drilling Services for Glass and Ceramic Materials 
[Nov 09, 2026]
[Nov 09, 2026] Product Description Product Features Very high peak power laser which meets various precision processing hard-brittle materials Patented optical shaping technology for thin film applications (Min pore size of ...
20807. Dry Process Laser Stealth Dicing Equipment for Silicon Sapphire LED Solar Wafers [Nov 09, 2026]
[Nov 09, 2026] Product Description This laser wafer modification stealth dicing equipment is designed for silicon wafers, silicon carbide (SiC) wafers, LED sapphire wafers, and solar-related semiconductor wafers, supporting ...
20808. Ultra Precision Picosecond Laser Cutter for Glass Artworks and Decorative Designs [Oct 26, 2026]
[Oct 26, 2026] High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power Product Description Product Features Ultra-fast pulsed picosecond laser with high peak power, stable and ...
20809. Advanced IGBT Laser Annealing System for Optimal Dopant Activation [Oct 21, 2026]
[Oct 21, 2026] Product Description Product Features High reliability and stability Independly developped Optical system Excellent thermal budget control 50μm ultra-thin TaiKo wafer handling capability Technical ...
20810. Full Automatic Detergent Soap Making Machine in China Soap Extruder Machine [Sep 28, 2026]
[Sep 28, 2026] LAP100-B Soap Finishing Line Full Automatic Detergent Soap Making Machine in China Soap Extruder Machine The LAP100-B model is a small standard soap-making machine that uses oil as raw material. It is not only fit for ...
Company: Nantong Sting Co., Ltd.
20811. Industrial Processing Needs Served by a Versatile High-Heat Furnace [Nov 03, 2026]
[Nov 03, 2026] High Quality Fmj Series High-Temperature Box Sintering Furnace Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation ...
20812. Vertical Furnace for Advanced Pi Cuer Annealing Solutions [Nov 03, 2026]
[Nov 03, 2026] Double-Tube Fully Automatic Vertical Furnace for PI Cuer, annealing, alloy Product Description Product Usage: Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, ...
20813. Precision Laser Grooving Technology for Efficient Wafer Production Processes [Oct 29, 2026]
[Oct 29, 2026] High Quality Low-K Wafer Laser Grooving Equipment with Automatic Adjustment of Grooving Width Product Description Product Features 8/12 inch compatible Ultra-fast UV picro-second laser. Excellent process results ...
20814. High Precision Industrial Vacuum Furnace for Welding and Brazing Applications [Oct 23, 2026]
[Oct 23, 2026] High Reliability Cavity Free Brazing of High-Power Chips and Substrate Vacuum Eutectic Welding Furnace Product Description Vacuum eutectic welding furnace VSR-20MPA The advanced process system assisted by ...
20815. Industrial Precision Laser Grooving Equipment for Quality Cutting Applications [Oct 23, 2026]
[Oct 23, 2026] High Quality Laser Grooving Cutting Equipment Equipped with Special Customized Laser Head Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion ...
20816. Advanced Plasma Cleaner for Efficient Wafer Photoresist Removal Equipment [Oct 29, 2026]
[Oct 29, 2026] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
20817. Versatile Gantry Wire Bonder Machine for Precision Assembly Applications [Oct 19, 2026]
[Oct 19, 2026] Product Description Our high-performance, fully automated wire bonder designed for a wide range of interconnection applications in semiconductor packaging. It is built with a robust long gantry XY system to accommodate ...
20818. Advanced High-Precision Automated Die Bonder for Multi-Chip Assembly Solutions [Oct 19, 2026]
[Oct 19, 2026] Product Description Our high-precision, multi-chip, automated die bonding system designed for advanced semiconductor and microelectronic assembly. It is engineered for flexibility, handling a wide variety of chip sizes ...
20819. CCD Technology Sic Chip Wafer Splitting Equipment for Advanced Processing [Nov 06, 2026]
[Nov 06, 2026] Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...
20820. 220V 400W 10*210mm Electric Injection Mould Cartridge Heater [Nov 04, 2026]
[Nov 04, 2026] 220V 400W 10*210mm Electric Injection Mould Cartridge Heater Our cartridge heaters are most frequently used for heating metal parts by insertion into drilled holes. Two basic forms, high watt density and low watt ...
Company: Yancheng Hongtai Alloy Electric Apparatus Co., Ltd.
