Jiangsu Profile
Product List
20746. Precision Laser Annealing Equipment for Advanced Wafer Processing 
[Feb 28, 2026]
[Feb 28, 2026] Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low ...
20747. High Precision Die Bonding Machine for PCB and IC Assembly [Feb 28, 2026]
[Feb 28, 2026] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
20748. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
20749. Fully Automatic IC Transfer Molding Equipment System Semiconductor Plastic Packaging Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Himalaya 002 Fully Automatic Semiconductor Molding Machine The Himalaya 002 is a state-of-the-art, fully automatic semiconductor molding machine engineered for high-precision, high-volume ...
20750. Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot [Feb 28, 2026]
[Feb 28, 2026] Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling ...
20751. Advanced Sic Laser Annealing Equipment for Industrial Solutions [Feb 28, 2026]
[Feb 28, 2026] 6 Inch 8 Inch Sic Laser Annealing Machine Sic Laser Annealing Equipment with Fully Autonomous Optical System Product Description Product Features First domestic green laser machine for mass pruduction High ...
20752. 6 Inch Wafer Ring Frame for Semiconductor SUS420J2 with Factory Direct Price [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
20753. Advanced High-Precision Automated Die Bonder for Multi-Chip Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Our high-precision, multi-chip, automated die bonding system designed for advanced semiconductor and microelectronic assembly. It is engineered for flexibility, handling a wide variety of chip ...
20754. 8-Inch SUS420J2 Wafer Dicing Frame for Semiconductor Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Introduce Our Stainless Steel Wafer Frame Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer ...
20755. Silicon Sapphire LED Solar Wafer Laser Stealth Dicing Equipment with Dry Process [Feb 28, 2026]
[Feb 28, 2026] Product Description This laser wafer modification stealth dicing equipment is designed for silicon wafers, silicon carbide (SiC) wafers, LED sapphire wafers, and solar-related semiconductor wafers, supporting ...
20756. Advanced Plasma Asher for Efficient Wafer Adhesive Removal Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
20757. High-Precision Gantry Wire Bonder Machine for Diverse Industrial Uses [Feb 28, 2026]
[Feb 28, 2026] Product Description Our high-performance, fully automated wire bonder designed for a wide range of interconnection applications in semiconductor packaging. It is built with a robust long gantry XY system to ...
20758. Rock Wool Acoustic Ceiling Panels Sound Absorbing Ceiling Board Material Stonewool Ceilings [Feb 28, 2026]
[Feb 28, 2026] DEGOFON Stonewool Acousticl Ceilings The Production process The base material of Degofon ceiling products is stone wool (resin bonded mineral wool) produced according to the principles of a volcanic eruption. By means ...
20759. 600X600mm Stone Wool Products Rock Wool Ceiling Tiles [Feb 28, 2026]
[Feb 28, 2026] Acoustic ceiling tiles 600*600mm/1200mm (2X2 2X4 ) Product name: Suspended Modules Ceilings Tile WHITE CEILING TILES The white and elegant DEGOFON acoustic ceiling can meet your needs in any space.Provide ...
20760. Acoustical Rock Wool Ceiling Stone Wool Ceiling Tiles [Feb 28, 2026]
[Feb 28, 2026] DEGOFON Acousticl Ceilings The base material of Degofon ceiling products is stone wool (resin bonded mineral wool) produced according to the principles of a volcanic eruption. By means of patented technology, stone is ...
