Jiangsu Profile
Product List
18241. Durable Stamping Part for Reliable Home Appliance Manufacturing 
[Mar 03, 2026]
[Mar 03, 2026] PRODUCT PARAMETERS. Precision sheet metal & stamping fabrication: specializing in custom sheet metal componentsand precision stamping parts. Utilizing laser cutting, CNC punching, and precision bendingtechnologies, we ...
Company: Wuxi Gelanten Technology Co., Ltd.
18242. Precision Stainless Steel Stamping Part Home Appliance Enclosure [Mar 03, 2026]
[Mar 03, 2026] PRODUCT PARAMETERS. Precision sheet metal & stamping fabrication: specializing in custom sheet metal componentsand precision stamping parts. Utilizing laser cutting, CNC punching, and precision bendingtechnologies, we ...
Company: Wuxi Gelanten Technology Co., Ltd.
18243. Laser Cutting Welding Punching Bending Sheet Metal Fabrication [Mar 03, 2026]
[Mar 03, 2026] PRODUCT PARAMETERS. Precision sheet metal & stamping fabrication: specializing in custom sheet metal componentsand precision stamping parts. Utilizing laser cutting, CNC punching, and precision bendingtechnologies, we ...
Company: Wuxi Gelanten Technology Co., Ltd.
18244. Anodized Aluminum Sheet Metal Fabrication Sheet Stamping Part [Mar 03, 2026]
[Mar 03, 2026] PRODUCT PARAMETERS. Precision sheet metal & stamping fabrication: specializing in custom sheet metal componentsand precision stamping parts. Utilizing laser cutting, CNC punching, and precision bendingtechnologies, we ...
Company: Wuxi Gelanten Technology Co., Ltd.
18245. Premium Stamping Parts for Durable Automotive Production Solutions [Mar 03, 2026]
[Mar 03, 2026] PRODUCT PARAMETERS. Precision sheet metal & stamping fabrication: specializing in custom sheet metal componentsand precision stamping parts. Utilizing laser cutting, CNC punching, and precision bendingtechnologies, we ...
Company: Wuxi Gelanten Technology Co., Ltd.
18246. Premium Aluminum Hardware Components for Home Electronics and Appliances [Mar 03, 2026]
[Mar 03, 2026] PRODUCT PARAMETERS. Precision sheet metal & stamping fabrication: specializing in custom sheet metal componentsand precision stamping parts. Utilizing laser cutting, CNC punching, and precision bendingtechnologies, we ...
Company: Wuxi Gelanten Technology Co., Ltd.
18247. Advanced Laser Trimming System for Precision Semiconductor Wafer Processing [Mar 02, 2026]
[Mar 02, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
18248. Advanced Double-Tube Vertical Furnace for Precision Pi Cuer Annealing [Mar 02, 2026]
[Mar 02, 2026] Double-Tube Fully Automatic Vertical Furnace for PI Cuer, annealing, alloy Product Description Product Usage: Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, ...
18249. High-Precision CCD Wafer Splitting Machine for Sic Semiconductor Chips [Feb 28, 2026]
[Feb 28, 2026] Wafer splitting machine Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, ...
18250. Precision Laser Cutting Machine for PCB and Flexible Circuits [Feb 28, 2026]
[Feb 28, 2026] Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, ...
18251. Precision Laser Annealing Equipment for Advanced Wafer Processing [Feb 28, 2026]
[Feb 28, 2026] Bsi-CCD Wafer Dopant Laser Annealing Equipment Precise Energy Density Control Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low ...
18252. High Precision Die Bonding Machine for PCB and IC Assembly [Feb 28, 2026]
[Feb 28, 2026] Product Description The DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, ...
18253. Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation ...
18254. High-Efficiency Plasma Cleaner for Wafer Photoresist Removal Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
18255. Fully Automatic IC Transfer Molding Equipment System Semiconductor Plastic Packaging Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Himalaya 002 Fully Automatic Semiconductor Molding Machine The Himalaya 002 is a state-of-the-art, fully automatic semiconductor molding machine engineered for high-precision, high-volume ...
