Jiangsu Profile
Product List
6631. 3000W Fiber Laser Cutting Machine for Metal Sheet 
[Sep 10, 2026]
[Sep 10, 2026] High performance and high-speed metal sheet laser cutting machine Equipped with multiple efficient cutting processes, achieving a cutting effect that balances high speed and precision. The refined process design not ...
6632. 3000W High Precision Fiber Laser Cutting Machine for Metal Sheet Processing [Sep 10, 2026]
[Sep 10, 2026] Yiyan Laser (Jiangsu) Co., Ltd., located in the Robot Industrial Park in Chengnan New District, Yancheng City, Jiangsu Province, is a high-tech laser equipment manufacturing enterprise integrating R&D, manufacturing, ...
6633. Advanced Laser Cutter for Precision Metal Sheet Processing [Sep 30, 2026]
[Sep 30, 2026] Automatic Laser Power Drum Cutting Machine for Traditional Sheet Metal Processing Product Description MPS-1500SL series laser processing flexible production line is the latest "fully automatic sheet metal laser ...
6634. Dual Table Laser Cutting Machine with Automatic Scrap Collection System for Metal [Sep 09, 2026]
[Sep 09, 2026] serial number Parameter Item Specification 1 Product Model YL S 6025 6000W 2 Laser Power 6000W 3 Working Area 6050mm × 2530mm 4 X Axis Travel 2530mm 5 Y Axis Travel 6050mm 6 Z Axis ...
6635. 13m × 2.5m Large Laser Cutting Machine for Ship Parts [Sep 08, 2026]
[Sep 08, 2026] Category Item Specification Processing Area & Working Range Processing Area (L × W) 13000 mm × 2500 mm X-Axis Travel 2530 mm Y-Axis Travel 13050 mm Z-Axis Travel 150 mm Accuracy X, Y ...
6636. 12000W 13025 Extended Table Fiber Laser Cutting Machine for Container Panels [Sep 08, 2026]
[Sep 08, 2026] Product Overview 12000W 13m Ultra Long Metal Sheet Laser Cutting Machine YL-D-13025 12000W 13m Ultra Long Metal Sheet Laser Cutting Machine YL-D-13025 is configured with a 13000 x 2500 mm processing range and 12000W ...
6637. Thick Plate Laser Cutting Machine for Laser Cutting of Plates [Sep 29, 2026]
[Sep 29, 2026] Category Item Specification Processing Area & Working Range Processing Area (L × W) 13000 mm × 3000 mm X-Axis Travel 3030 mm Y-Axis Travel 13030 mm Z-Axis Travel 150 mm Accuracy X, Y ...
6638. 12kw Fiber Laser Cutting Machine for Dust Removal Environmental Protection Metal Cutting [Sep 29, 2026]
[Sep 29, 2026] Category Item Specification Processing Area & Working Range Processing Area (L × W) 13000 mm × 3000 mm X-Axis Travel 3030 mm Y-Axis Travel 13030 mm Z-Axis Travel 150 mm Accuracy X, Y Axis Positioning Accuracy ±0.05 mm/m ...
6639. Ground Rail Heavy Duty CNC Laser Cutting Machine for Thick Plate Cutting [Sep 29, 2026]
[Sep 29, 2026] Category Item Specification Processing Area & Working Range Processing Area (L × W) 12000 mm × 2500 mm X-Axis Travel 2530 mm Y-Axis Travel 12050 mm Z-Axis Travel 150 mm Accuracy X, Y ...
6640. 3015 3000W Exchange Table Fiber Laser Cutting Machine for Carbon & Stainless Steel [Sep 29, 2026]
[Sep 29, 2026] Product Overview 3000W Exchange Table Fiber Laser Cutting Machine YL-S-3015 3000W Exchange Table Fiber Laser Cutting Machine YL-S-3015 is configured with a 3050 x 1530 mm processing range and 3000W laser power. ...
6641. Industrial 6kw 3015 CNC Gantry Fiber Laser Cutter for Copper Aluminum [Sep 29, 2026]
[Sep 29, 2026] SHEET FIBER LASER CUTTING MACHINE Specification Essential Functional Components 1. Main Bed of Machine Tool 1) Engineered from premium steel, precisely welded for unmatched strength and stability. 2) Stress-relief ...
Company: Jiangsu SOHO Innovation & Technology Group Kasin Industry & Trade Co., Ltd.
6642. Advanced UV Laser Engraving Machine for Die Marking Solutions [Sep 28, 2026]
[Sep 28, 2026] Product Description Fully Automatic Wafer DIE Laser Marking System: The Future of Semiconductor Marking Introduction The Fully Automatic Wafer DIE Laser Marking System is a cutting-edge semiconductor marking ...
6643. Advanced GaN Wafer Laser Dicing System for Semiconductor Manufacturing [Sep 28, 2026]
[Sep 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
6644. Advanced Wafer Thinning Grinding Machines for High Precision [Sep 28, 2026]
[Sep 28, 2026] Product Description High precision grinding machine equipment principle: 1. This series of transverse thinning grinding machine is a fully automatic precision grinding equipment. The workpiece is rotated in the ...
6645. CNC Raycus/Max Fiber Laser Cutting Machine for Stainless Steel [Sep 07, 2026]
[Sep 07, 2026] Product Hero Poster Product Overview 3000W Open Type Fiber Laser Cutting Machine YL-D-3015 for Sheet Metal 3000W Open Type Fiber Laser Cutting Machine YL-D-3015 for Sheet Metal is configured with a 3050 x 1530 mm ...
