Jiangsu Profile
Product List
11356. Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning 
[Feb 28, 2026]
[Feb 28, 2026] Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning Product Description SQX series Manual cleaning machine SQX series manual cleaning machine is designed as a kind of manual operating wet ...
11357. China Wholesale Ultra-Shallow Dopant Laser Annealing Equipment for Semiconductor Machine Bsi-CCD ... [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
11358. Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms [Feb 28, 2026]
[Feb 28, 2026] Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...
11359. Advanced Ultra-Shallow UV Dopant Laser Annealing Equipment for Bsi-CCD & Sic Wafers [Feb 28, 2026]
[Feb 28, 2026] Premium-Grade Sic UV Laser Annealing Machine for BSI-CCD Wafers Product Description Shallow Dopant Laser Annealing for BSI-CCD and Advanced Semiconductors In the relentless pursuit of smaller, faster, and more ...
11360. Dry-in/Dry-out (DIDO) Process Chemical Mechanical Polishing Machine System for Wafer Polishing [Feb 28, 2026]
[Feb 28, 2026] Product Description Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability Support the flattening process requirements of SiC, GaN third-generation ...
11361. Fully Automaric Dry-in/Dry-out CMP Polisher/Tool for Wafer Cleaning System - Horizon300 [Feb 28, 2026]
[Feb 28, 2026] Product Description Fully Automatic CMP Polisher is designed for thin film (dielectric layer) processing, offering user-friendly operation and strong compatibility. By simply changing the polishing head, it can ...
11362. Projection Lithography Machine Suitable for Packaging Micro LED Mems [Feb 28, 2026]
[Feb 28, 2026] Product Description MPS-02 Projection lithography Product advantages 1.High yield 2.Modular design 3.High reliability 4.Suitable for packaging MicroLED MEMS and other processes Wafer Size 200mm Wafer(300mm ...
11363. High-Precision Automated Laser Marking System for Industrial Use [Feb 28, 2026]
[Feb 28, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
11364. High-Precision CO2 Laser Engraving Machine for Wood and Plastic [Feb 28, 2026]
[Feb 28, 2026] Product Description It can be widely used in graphic marks on craft gifts, clothing leather, wood paper, food packaging, FPC, ceramics, semiconductors, crystal glass, plastic parts, silicone rubber products and other ...
11365. High-Precision Laser Cutting Machine with Advanced CCD Positioning [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / ...
11366. High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond & Posbond ...
11367. High-Speed Automated SMT Assembly Line for Efficient Bulk Production [Feb 28, 2026]
[Feb 28, 2026] Product Description This device is specifically designed for fully automatic eutectic mounting of TO (transistor shaped) laser devices. Starting from the loading of TO tube shells, the production process of TO ...
11368. Fully Automatic Laser Grooving Equipment for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Laser Grooving Equipment for Semiconductor Wafers This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type ...
11369. Advanced Workflow Lamination and Encapsulation System for Efficiency [Feb 28, 2026]
[Feb 28, 2026] Features •Complete the processes of short-side butyl adhesive, short side insulating adhesive, short-side busbar tape, long-side conductive adhesive tape, four-side butyl adhesive tape film covering, and ...
11370. Dental Chair with LED Light Lamp Advanced Oral Portable Chinese Dental Unit [Feb 28, 2026]
[Feb 28, 2026] Dental Chair with LED Light Lamp advanced oral portable Chinese Dental Unit Model: FN-DU4 Advantatges: 1. This is our patent design, we spent a lot of money to open the mould, you can see the dental unit with ...
Company: Nanjing Foinoe Co., Ltd.
