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Product List
11341. High-Performance Sic Laser Annealing System for Wafer Efficiency 
[Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
11342. Automatic Glue Dispenser Machine Three-Axis Desktop Dispensing Robot Vision Glue Dispensing Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD grounding point- CE certifed Optional Features Automatic constant ...
11343. Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System [Feb 28, 2026]
[Feb 28, 2026] Small Versatile Lithography Product Equipped With MLC600 Maskless Lithography System Product Description Measurement Precision: Current Range Precision Voltage Range Precision 10nA ±(1% + 0.04% FS + ...
11344. High Precision UV Laser Cutting Machine for Wafer Processing [Feb 28, 2026]
[Feb 28, 2026] High Precision UV Laser Marking Cutting Machine for Wafers Cutting Processing Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting ...
11345. Visual Glue Dispenser Machine Automatic CCD Three-Axis Desktop Dispensing Robot Equipment [Feb 28, 2026]
[Feb 28, 2026] Automatic CCD Visual Glue Dispenser Machine semiautomatic Three-Axis Desktop Dispensing Robot equipment factory Product Description Standard Features Computer Control, Windows OS CCD visual positioning ...
11346. High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series) [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser resistor trimming is the mainstream process of resistor trimming , which has the highest precision and efficiency , and can complete the functiontrimming of the circuit . The high-precision ...
11347. Automated Microchip Dispensing Machines for Efficient Manufacturing Lines [Feb 28, 2026]
[Feb 28, 2026] Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...
11348. Advanced Fully Automatic Laser Marking Machine for Wafer ID [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Wafer ID Laser Marking Machine Product Description 1. Applied to semiconductor wafer ID marking, compatible with products under 12 inches; 2. Fully automatic operation, equipped with FFU ...
11349. Advanced Sic UV Laser Annealing Machine for Bsi-CCD Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two wavelengths are ...
11350. High-Precision UV Laser Cutter for Automotive Circuit Board Production [Feb 28, 2026]
[Feb 28, 2026] PCBA/Fpcba UV Laser Cutting Machine for Precise Processing of Auto Industry Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the ...
11351. Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing [Feb 28, 2026]
[Feb 28, 2026] Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, ...
11352. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
11353. Professional High-Precision CO2 Laser Engraver for Custom Projects [Feb 28, 2026]
[Feb 28, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
11354. High Precision Wafer Die Bonder for Superior Dispensing Accuracy [Feb 28, 2026]
[Feb 28, 2026] High Precision Wafer Die Bonder Dispensing Equipment Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm ...
11355. Advanced Precision Laser Drilling Equipment for Zirconium and Alumina [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
