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Premium Gp Silicone Sealant for Kitchen and Bathroom Waterproofing
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9841.

Premium Gp Silicone Sealant for Kitchen and Bathroom Waterproofing Open Details in New Window [Feb 12, 2026]

Discover the RT-696: a true marvel in the sealant industry that epitomizes engineering perfection. This cutting-edge, single-component acetic silicone sealant is meticulously crafted for seamless application and rapid ...

Company: Jiangsu Runtai Sealant Industry Co., Ltd

Insulation Aluminum Foil Coating Fiberglass Cloth for Pipe Construction Materials
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9842.

Insulation Aluminum Foil Coating Fiberglass Cloth for Pipe Construction Materials Open Details in New Window [Jan 29, 2026]

Product Description Aluminized Fiberglass Fabric are made of fiberglass fabrics laminated an aluminum foil or film on one side. It can resistant radiant heat, and has a smooth surface, high strength, good luminous ...

Company: Nan Jing New Fire Composite Co., Ltd

Heat Resistant Ceramic Insulators Insulating Electrical C221 Steatite Ceramic Part
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9843.

Heat Resistant Ceramic Insulators Insulating Electrical C221 Steatite Ceramic Part Open Details in New Window [Feb 27, 2026]

Heat Resistant White Ceramic Insulators Insulating Electrical C221 Steatite Ceramic Part Product Description Product Name Steatite ceramic insulator Material Steatite Color Ivory/White Size AS per ...

Company: LIANYUNGANG BAIBO NEW MATERIAL CO., LTD.

CE Portable 500W Pulsed Laser Cleaning Machine for Rust and Paint Removal
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9844.

CE Portable 500W Pulsed Laser Cleaning Machine for Rust and Paint Removal Open Details in New Window [Jan 28, 2026]

Product Description 500W Pulse laser cleaning machine Laser cleaning is an emerging cleaning method in industrial cleaning. Our company's LCP-500 (standard product) laser cleaning equipment adopts high peak power ...

Company: SUZHOU CHIRUI ELECTROMECHANICAL TECHNOLOGY CO., LTD.

Advanced Industrial Magnetron Sputtering System for Precision Coatings
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9845.

Advanced Industrial Magnetron Sputtering System for Precision Coatings Open Details in New Window [Feb 28, 2026]

Our independently developed physicalvapor deposition (PVD) magnetron sputtering system is compatible with both front-side and back-side metalization processes (for thin-wafer bonding applications). this equipped with a ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
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9846.

High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device Open Details in New Window [Feb 28, 2026]

Product Description Mainly used in the final process of surface mount semiconductor device production, it can automatically complete the electrical parameter testing, classification and selection storage, laser ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Precision Laser Cutting Machine for PCB and Pet Materials
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9847.

Precision Laser Cutting Machine for PCB and Pet Materials Open Details in New Window [Feb 28, 2026]

High End Fully Automatic Fpca/PCBA/Pi/Pet Laser Cutting Equipment Product Description System Feature Intelligent Control Software: Independently developed software with multi-panel cutting, self-assembly, dynamic ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Green Laser Cutting System for Sic Wafer Dicing
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9848.

Fully Automatic Green Laser Cutting System for Sic Wafer Dicing Open Details in New Window [Feb 28, 2026]

Product Description Our Precision Green Laser Cutting System represents the forefront of laser processing technology for brittle and heat-sensitive materials. Utilizing a specialized 532nm wavelength laser source, this ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Laser Solutions for Enhanced Semiconductor Manufacturing Processes
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9849.

Advanced Laser Solutions for Enhanced Semiconductor Manufacturing Processes Open Details in New Window [Feb 28, 2026]

High Productivity Laser Induced Epitaxial Growth Equipment with Large-aspect Ratio machine factory Product Description Product Features First domestic 12 inch mass production equipment High precise beam ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Qxh-3116 Lead Wire Bonding Bonder Machine Fully Automatic
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9850.

Qxh-3116 Lead Wire Bonding Bonder Machine Fully Automatic Open Details in New Window [Feb 28, 2026]

QXH-3116 Lead Wire Bonding Bonder Machine Fully Automatic Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Innovative Fully Automatic Sealing Solution for Optical Devices
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9851.

Innovative Fully Automatic Sealing Solution for Optical Devices Open Details in New Window [Feb 28, 2026]

Parameter Module Name Primary Function Sealing/Welding Module Seals/fuses outer shells of optical devices; compatible with TO56/TO46/TO38/EML. Auto Loading/Unloading Module Automates material handling for efficient ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Semiconductor Glue Coating and Developing Equipment
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9852.

Fully Automatic Semiconductor Glue Coating and Developing Equipment Open Details in New Window [Feb 28, 2026]

Fully Automatic Semiconductor Glue Coating and Developing Equipment Product Description Advanced Semiconductor Coating Systems: Revolutionizing Wafer-Level Manufacturing Efficiency Cutting-Edge Solutions for Next-Gen ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Mps-6020d Fiber Laser Cutter for Metal Sheets
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9853.

High-Precision Mps-6020d Fiber Laser Cutter for Metal Sheets Open Details in New Window [Feb 28, 2026]

Mps-6020d Fiber Laser Cutting Machine for The Large-Scale Sheet Metal Processing Industry Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
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9854.

High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device Open Details in New Window [Feb 28, 2026]

Product Description This machine is equipped with a wafer splitting device for brittle materials such as 2 "~8" LED/SIC/glass/ceramic. The laser processed wafer is supported by the receiving platform as a reference, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Semiconductor Auto Transfer Molding Equipment with Visual System
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9855.

Advanced Semiconductor Auto Transfer Molding Equipment with Visual System Open Details in New Window [Feb 28, 2026]

Product Description Himalaya 002 Fully Automatic Semiconductor Molding Machine The Himalaya 002 is a state-of-the-art, fully automatic semiconductor molding machine engineered for high-precision, high-volume ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.