Jiangsu Profile
Product List
9556. 355nm UV Laser Depaneling Machine: 20μM Precision Cutting for PCB 
[Feb 28, 2026]
[Feb 28, 2026] Product Description 355nm UV Laser Cutting Machine Laser depaneling machine for PCB and related industry. Utilizing a high-performance UV laser, it minimizes the heat-affected zone for high-density PCBA products. ...
9557. High-Precision Laser Engraver for Secure Product Marking Solutions [Feb 28, 2026]
[Feb 28, 2026] Anti-Counterfeiting Laser Marking Machine High Speed Flying Laser Engraving Printing Machine Product Description Brief Description The laser marking machine can code cigarettes, package cigarettes, strip cigarettes, ...
9558. High-Precision Fiber Laser Marking Machine for Packaging Solutions [Feb 28, 2026]
[Feb 28, 2026] Online Flying Fiber Laser Marking Machine for Flexible Packaging Films Product Description Brief Description CO2 series products are mainly applicable to non-metallic materials of high-speed flight marking, such as ...
9559. Fully Automatic Semiconductor High-Precision Die Attach Provide Flexible Packaging Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Technical Overview: High-Speed Die Bonding (Die Attach) Systems Die Bonding is the foundational step in semiconductor assembly.It involves picking a single silicon die (chip) from a processed ...
9560. Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing [Feb 28, 2026]
[Feb 28, 2026] Jewelry Fiber Laser Engraving Marking Machine with System Easy to 3D Processing Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, ...
9561. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
9562. Professional High-Precision CO2 Laser Engraver for Custom Projects [Feb 28, 2026]
[Feb 28, 2026] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
9563. High Precision Wafer Die Bonder for Superior Dispensing Accuracy [Feb 28, 2026]
[Feb 28, 2026] High Precision Wafer Die Bonder Dispensing Equipment Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm ...
9564. Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning [Feb 28, 2026]
[Feb 28, 2026] Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning Product Description SQX series Manual cleaning machine SQX series manual cleaning machine is designed as a kind of manual operating wet ...
9565. High-Precision CCD Glue Dispensing Machine for Exact Placement [Feb 28, 2026]
[Feb 28, 2026] Product Description This is a modular, vision-guided, high-speed precision dispensing system designed for advanced electronics manufacturing. Its standout features are chip-body recognition for exceptional accuracy, ...
9566. Advanced Laser Wafer Marking System for Precision Depth Control [Feb 28, 2026]
[Feb 28, 2026] High Precision Laser Processing&Depth Control Wafer Laser Marking Machine Product Description Product Features High precision laser processing&depth control Auto sample transfer, high precision positioning Auto ...
9567. China Wholesale Ultra-Shallow Dopant Laser Annealing Equipment for Semiconductor Machine Bsi-CCD ... [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
9568. Innovative Plasma Treatment Machine for Effective Surface Cleaning [Feb 28, 2026]
[Feb 28, 2026] Plasma Treatment System Cleaning Machine Product Description FEATURES: 1. Stable operation - Adopt integral casting iron frame and gantry platform to improve operation stability; 2. Use WINDOWS operating system - ...
9569. Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms [Feb 28, 2026]
[Feb 28, 2026] Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...
9570. Advanced Ultra-Shallow UV Dopant Laser Annealing Equipment for Bsi-CCD & Sic Wafers [Feb 28, 2026]
[Feb 28, 2026] Premium-Grade Sic UV Laser Annealing Machine for BSI-CCD Wafers Product Description Shallow Dopant Laser Annealing for BSI-CCD and Advanced Semiconductors In the relentless pursuit of smaller, faster, and more ...
