Jiangsu Profile
Product List
19681. Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting 
[Jul 22, 2025]
[Jul 22, 2025] Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, ...
19682. Sic Ultra-Thin Wafer Laser Slicing Machine with High Precision Optical Scanning Processing System [Jul 22, 2025]
[Jul 22, 2025] Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...
19683. Anti-Counterfeiting Laser Marking Machine High Speed Flying Laser Engraving Printing Machine [Jul 22, 2025]
[Jul 22, 2025] Anti-Counterfeiting Laser Marking Machine High Speed Flying Laser Engraving Printing Machine Product Description Brief Description The laser marking machine can code cigarettes, package cigarettes, strip cigarettes, ...
19684. Dzx Series Efficient Automation Online Plasma Cleaning Machine [Jul 22, 2025]
[Jul 22, 2025] Product Description The equipment can remove the particles on the chips and frameworks according to the lead frame characteristics of IC packaging to improve material surface activity ,advancing wire bonding ...
19685. Factory Wholesale Price Dqx Series Integrated Circuit IC Microwave Plasma Cleaning Machine [Jul 22, 2025]
[Jul 22, 2025] Product Description Mainly for the integrated circuit IC packaging process characteristics, remove the chip and frame surface micro-particle pollution and oxide, to improve the surface properties of materials, ...
19686. Semiconductor Copper Layer Electrochemical Stripping System [Jul 22, 2025]
[Jul 22, 2025] Corrosion Stripping Copper Equipment refers to industrial systems designed to selectively remove copper layers or corrosion products from substrates through chemical, electrochemical, or plasma-assisted processes. These ...
19687. Fully Automated Production Sic / Si Laser Wafer Internal Modification Machine with Excellent ... [Jul 22, 2025]
[Jul 22, 2025] Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser system 2. Excellent cutting effect 3. Fully automated production 4. High precision ...
19688. Hans-F6m Full Linear Motor Six Axis CNC Drilling Machine Used for Drilling Large Quantities of ... [Jul 22, 2025]
[Jul 22, 2025] Product Description HANS-F6M Product advantages High speed : XYZ axis full linear motor drive , free maintenance , no wear , efficiency greatly improved High precision : full digital dynamic simulation design of high ...
19689. 355nm UV Laser Cutting Machine for 2 Inch/4 Inch/8 Inch/12 Inch Wafers Cutting Processing [Jul 22, 2025]
[Jul 22, 2025] Product Description Brief Description Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing Features: 1. With 355nm UV laser, the cutting machine has stable performance, good light ...
19690. Mh300 Series CCD Vision Automatic Four-Wire Testing Machine Equipped with One Touch Fixture [Jul 22, 2025]
[Jul 22, 2025] Product Description Equipped with One Touch fixture UVW fine tuning platform CCD automatically improves positioning accuracy Four-wire low resistance test to detect all the hole copper missing , micro open ...
19691. Laser IC Marking Equipment with Mes Mark Module System [Jul 22, 2025]
[Jul 22, 2025] Laser IC Marking Equipment With MES Mark module system Product Description Laser IC Marking Equipment Equipment features: 1. Support MES Mark module system 2. Mark Auto download 3. Automatic generation of ...
19692. Plasma Treatment System Cleaning Machine [Jul 22, 2025]
[Jul 22, 2025] Plasma Treatment System Cleaning Machine Product Description FEATURES: 1. Stable operation - Adopt integral casting iron frame and gantry platform to improve operation stability; 2. Use WINDOWS operating system - ...
19693. Factory Price Vertical Wafer Clean Configuration 12 Inch CMP Device - Horizon300 [Jul 22, 2025]
[Jul 22, 2025] Product Description 4-Head & 3-Platen polisher; Vertical wafer clean configuration. Integration of multiple advanced endpoint system and a fully precise process control system. Meet CMP process requirements for 28nm ...
19694. High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer [Jul 22, 2025]
[Jul 22, 2025] High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser ...
19695. Silicon Wafer Laser Stealth Cutting Equipment Equipped with Laser Spot Shaping and Compensation ... [Jul 22, 2025]
[Jul 22, 2025] Product Description Equipment Advantage Equipped with high precision linear motor and high speed X-Y motion platform Equipped with high precision dynamic focus tracking and compensation system to ensure the ...
