Jiangsu Profile
Product List
19666. Plastic Recycling Granulating Production Line/Plastic Pellet Machine PP Woven Bag Recycling ... 
[Jul 24, 2025]
[Jul 24, 2025] Product Description 1. Plastic pellet machine extruder Parameter Mode Diameter(mm) L/D Rotating speed Power(kw) Capacity(kg/h) (r/min) TSE-20 22 32-44 600 5.5 0.5-10 TSE-30A 31 ...
19667. Pet PP LDPE PA PVC Glass Fiber Nylon Recycle Plastic Granules Making Machine Price [Jul 24, 2025]
[Jul 24, 2025] Product Description 1. Plastic pellet machine extruder Parameter Mode Diameter(mm) L/D Rotating speed Power(kw) Capacity(kg/h) (r/min) TSE-20 22 32-44 600 5.5 0.5-10 TSE-30A 31 ...
19668. Plastic Waste Material Recycle Granulating Machine [Jul 24, 2025]
[Jul 24, 2025] Product Description 1. Plastic pellet machine extruder Parameter Mode Diameter(mm) L/D Rotating speed Power(kw) Capacity(kg/h) (r/min) TSE-20 22 32-44 600 5.5 0.5-10 TSE-30A 31 ...
19669. PVA Ceramic Cleaning Sponge Roller for Circuit Boards [Jul 23, 2025]
[Jul 23, 2025] Product Description Product name PVA Water Absorbent Sponge Roller Size Can be customized by customer's detail requests Filament material PVA Sponge, PU, PO, Foam Base material PP, PVC, Galvanized, Stainless ...
19670. Flip Chip Die Bonder Machine for Semiconductor Packaging [Jul 22, 2025]
[Jul 22, 2025] Flip Chip Die Bonder Machine for Semiconductor Packaging Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration ...
19671. High Quality PCB Laser Marking System [Jul 22, 2025]
[Jul 22, 2025] High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA ...
19672. Dbc Sintering Furnace for High Temperature Heat Treatment of Power Semiconductor Devices [Jul 22, 2025]
[Jul 22, 2025] Dbc Sintering Furnace for High Temperature Heat Treatment of Power Semiconductor Devices Product Description 1. Technical indicators The use of temperature RT-1100 C. The uniformity of the furnace is better than ...
19673. High Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform [Jul 22, 2025]
[Jul 22, 2025] High Precision Laser Cutting Machine with a Stable Movable Gantry Marble Platform Product Description The MPS-0806L laser cutting machine adopts configurations such as a precision linear motor platform and a Han's ...
19674. Plate Tube Optical Fiber Laser Cutting Machine for Rail Transit, Shipbuilding, Automotive, ... [Jul 22, 2025]
[Jul 22, 2025] Product Description MPS-DT is one of the flagship products, mainly used for cutting thin metal plates and laser cutting of metal pipes such as round, square, rectangular, and elliptical pipes made of ordinary carbon ...
19675. Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting [Jul 22, 2025]
[Jul 22, 2025] Laser Cutting Machine for PCB Printed Circuit Board Flex PCB Laser Cutting Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, ...
19676. Sic Ultra-Thin Wafer Laser Slicing Machine with High Precision Optical Scanning Processing System [Jul 22, 2025]
[Jul 22, 2025] Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...
19677. Anti-Counterfeiting Laser Marking Machine High Speed Flying Laser Engraving Printing Machine [Jul 22, 2025]
[Jul 22, 2025] Anti-Counterfeiting Laser Marking Machine High Speed Flying Laser Engraving Printing Machine Product Description Brief Description The laser marking machine can code cigarettes, package cigarettes, strip cigarettes, ...
19678. Dzx Series Efficient Automation Online Plasma Cleaning Machine [Jul 22, 2025]
[Jul 22, 2025] Product Description The equipment can remove the particles on the chips and frameworks according to the lead frame characteristics of IC packaging to improve material surface activity ,advancing wire bonding ...
19679. Factory Wholesale Price Dqx Series Integrated Circuit IC Microwave Plasma Cleaning Machine [Jul 22, 2025]
[Jul 22, 2025] Product Description Mainly for the integrated circuit IC packaging process characteristics, remove the chip and frame surface micro-particle pollution and oxide, to improve the surface properties of materials, ...
19680. Semiconductor Copper Layer Electrochemical Stripping System [Jul 22, 2025]
[Jul 22, 2025] Corrosion Stripping Copper Equipment refers to industrial systems designed to selectively remove copper layers or corrosion products from substrates through chemical, electrochemical, or plasma-assisted processes. These ...
