Jiangsu Profile
Famous Export Brand
Product List
18556. Ju-5.5m Izod Impact Testing Machine for Non-Metallic Material 
[Mar 04, 2026]
[Mar 04, 2026] JU-5.5M Izod Impact Testing Machine Product Overview The Impact Testing Machine is meticulously engineered to evaluate the impact toughness of diverse non-metallic materials. This includes a spectrum of materials ...
Company: Jiangsu Wallong-Hsin Machinery Engineering Corporation Ltd.
18557. Kt-1200 1~6mm Thickness Bio Soluble Fiber Paper for Thermal Insulation [Mar 03, 2026]
[Mar 03, 2026] KT-1200 1~6mm thickness Bio soluble fiber paper for Thermal Insulation Product Description KT ceramic fibre paper is manufactured from high purity ceramic fibre, adopting the wet inorganic ceramic fiber ...
Company: Kaowoo Thermal Insulation Co., Ltd
18558. Dk29 Kafuter K-705 Clear Silicone Adhesive Sealant for Industrial Bonding Sealing [Mar 02, 2026]
[Mar 02, 2026] Product Description Company Profile Our Advantages 1. World-Class Bearing: We provide our customers with all types of indigenous bearing with world-class quality. 2. OEM or Non-Stand Bearings: Any requirement for ...
Company: Jingjiang E-Asia Bearing Co., Ltd.
18559. Dental Laboratory Furniture Lab Bench Lab Table for Hospital and Clinic (JH-SL201) [Mar 02, 2026]
[Mar 02, 2026] Model: JH-SL201 Steel Dental Laboratory Furniture 1. Certification: Authorized SGS certification showing the conformity of US standard SEFA-8M, which test many items including weight capacity of steel cabinet ...
18560. High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series) [Feb 28, 2026]
[Feb 28, 2026] Product Description Laser resistor trimming is the mainstream process of resistor trimming , which has the highest precision and efficiency , and can complete the functiontrimming of the circuit . The high-precision ...
18561. Automated Microchip Dispensing Machines for Efficient Manufacturing Lines [Feb 28, 2026]
[Feb 28, 2026] Product Description This device is used for micro assembly, dispensing, and surface mounting processes. It has the characteristics of multi threading, multi timing, flexible process combination, complex logic and ...
18562. High Precision Automatic Wafer Eutectic Bonder Die Bonder Bonding Machine [Feb 28, 2026]
[Feb 28, 2026] Product Description High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine Category Parameter Specification System Cycle time 230ms Performance X/Y placement ...
18563. Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning [Feb 28, 2026]
[Feb 28, 2026] Single Chip Cleaning/Scrubbing Machine for Wafer Corrosion Cleaning Product Description SQX series Manual cleaning machine SQX series manual cleaning machine is designed as a kind of manual operating wet ...
18564. China Wholesale Ultra-Shallow Dopant Laser Annealing Equipment for Semiconductor Machine Bsi-CCD ... [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Features The first in China, 8 inch mass production equipment Precise energy density control UV laser with low penetration depth 1D top hat beam with large lengh/width ratio Low dopant ...
18565. Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms [Feb 28, 2026]
[Feb 28, 2026] Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts ...
18566. Advanced Ultra-Shallow UV Dopant Laser Annealing Equipment for Bsi-CCD & Sic Wafers [Feb 28, 2026]
[Feb 28, 2026] Premium-Grade Sic UV Laser Annealing Machine for BSI-CCD Wafers Product Description Shallow Dopant Laser Annealing for BSI-CCD and Advanced Semiconductors In the relentless pursuit of smaller, faster, and more ...
18567. Dry-in/Dry-out (DIDO) Process Chemical Mechanical Polishing Machine System for Wafer Polishing [Feb 28, 2026]
[Feb 28, 2026] Product Description Compatible with 6/8-inch wafers, fully automatic dry in and dry out, flexible process switching, and wide applicability Support the flattening process requirements of SiC, GaN third-generation ...
18568. Projection Lithography Machine Suitable for Packaging Micro LED Mems [Feb 28, 2026]
[Feb 28, 2026] Product Description MPS-02 Projection lithography Product advantages 1.High yield 2.Modular design 3.High reliability 4.Suitable for packaging MicroLED MEMS and other processes Wafer Size 200mm Wafer(300mm ...
18569. Fully Automatic Laser Grooving Equipment for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] Fully Automatic Laser Grooving Equipment for Semiconductor Wafers This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type ...
18570. Advanced Workflow Lamination and Encapsulation System for Efficiency [Feb 28, 2026]
[Feb 28, 2026] Features •Complete the processes of short-side butyl adhesive, short side insulating adhesive, short-side busbar tape, long-side conductive adhesive tape, four-side butyl adhesive tape film covering, and ...
