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Automatic High Precision Die Bonder Die Bonding Machine for Dfn/Mems/Sop-8/Tssop
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18001.

Automatic High Precision Die Bonder Die Bonding Machine for Dfn/Mems/Sop-8/Tssop Open Details in New Window [Sep 18, 2025]

Product Description DA1201FC Flip Chip and Die Attach X/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder
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18002.

Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder Open Details in New Window [Sep 18, 2025]

Vacuum Surface Suction High Precision Eutectic Bonding Die Bonder Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Performance Mps-1010d Precision Laser Cutting Machine for Glasses Frame Processing/Hardware ...
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18003.

High Performance Mps-1010d Precision Laser Cutting Machine for Glasses Frame Processing/Hardware ... Open Details in New Window [Sep 18, 2025]

Product Description MPS-1010D is a product specially for the metal sheet industry, mainly used for cutting 0.5mm-16mm metal flat plates. It has a closed structure, superior performance, stability, and extremely high ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Quality ISO Approved Automatic Equipment for Circuit Board Laser Cutting Machine
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18004.

High Quality ISO Approved Automatic Equipment for Circuit Board Laser Cutting Machine Open Details in New Window [Sep 18, 2025]

Product Description Product Features Select laser, fixture and stage according to actual product processing needs One machine for drilling, cutting and scribing, reducing customer costs Support full cutting / ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Frame Laser Barcode Engraving Machine with Secs-Gem Communication Networking ...
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18005.

Fully Automatic Frame Laser Barcode Engraving Machine with Secs-Gem Communication Networking ... Open Details in New Window [Sep 18, 2025]

Product Description Product Features Fully automatic loading and unloading. Automatic reverse prevention and 2D code detection Vision recognizes laser printed 2D codes Automatic generation of Mapping data SECS-GEM ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Beam Quality and High Reliability Metal Materials Fiber Laser Marking Machine
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18006.

High Beam Quality and High Reliability Metal Materials Fiber Laser Marking Machine Open Details in New Window [Sep 18, 2025]

Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance
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18007.

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance Open Details in New Window [Sep 18, 2025]

High-Speed PCB Board Circuit Board Dispensing Machine with High-Performance Product Description Standard Features 1. Computer control with Windows OS 2. CCD visual positioning system 3. Servo motor with ball ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Factory Price Fiber Laser Marking Machine on Metal/Non-Metal Materials
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18008.

Factory Price Fiber Laser Marking Machine on Metal/Non-Metal Materials Open Details in New Window [Sep 18, 2025]

Factory Price Fiber Laser Marking Machine on Metal/Non-Metal Materials Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments
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18009.

Laser Cutting Equipment Manufacturer for Hardware Accessories/Electronic Devices/Instruments Open Details in New Window [Sep 18, 2025]

Product Description Mps-0303l precision laser cutting machine is a linear motor platform, with high precision, high speed, good cutting quality, processing width of 300 mm × 300 mm, which can be used in ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fiber Laser Cutting Machine Combined with Excellent Heat Treatment and Machining Processes
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18010.

Fiber Laser Cutting Machine Combined with Excellent Heat Treatment and Machining Processes Open Details in New Window [Sep 18, 2025]

Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Low-K Wafer Laser Grooving Equipment with Automatic Adjustment of Grooving Width
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18011.

Low-K Wafer Laser Grooving Equipment with Automatic Adjustment of Grooving Width Open Details in New Window [Sep 18, 2025]

Product Description Product Features 8/12 inch compatible Ultra-fast UV picro-second laser. Excellent process results Automatic adjustment of grooving width Auto-focus, image memorization and identification, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment
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18012.

Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment Open Details in New Window [Sep 18, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y&le;&plusmn;25um,&theta;<&plusmn;3&deg; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Industrial Laser Marking Engraving Machine for Metal, Bearings, Industrial Tools, Metal Tools
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18013.

Industrial Laser Marking Engraving Machine for Metal, Bearings, Industrial Tools, Metal Tools Open Details in New Window [Sep 18, 2025]

Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Hot Sale Fiber Laser Marking Machine on Steel/ Aluminum/Silver/Gold/Silicon Materials
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18014.

Hot Sale Fiber Laser Marking Machine on Steel/ Aluminum/Silver/Gold/Silicon Materials Open Details in New Window [Sep 18, 2025]

Hot Sale Fiber Laser Marking Machine On Steel/ Aluminum/Silver/Gold/Silicon materials Product Description Features: 1. Utilizes the world's largest source of Fiber lasers-IPG Photonics. 2. Adopts the newest ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Performance High Efficiency PCB/FPC/RF/Touchid/Type-C/TF-Card/LGA/BGA Module Laser Cutting Machine
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18015.

Performance High Efficiency PCB/FPC/RF/Touchid/Type-C/TF-Card/LGA/BGA Module Laser Cutting Machine Open Details in New Window [Sep 18, 2025]

Product Description Product Features Staggered cutting with double stations for high efficiency Adopt telecentric lens, good cutting verticality Off-axis CCD automatic positioning system, high cutting ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.