Jiangsu Profile
Product List
17986. Fully Automatic Vacuum Vertical Oven Used in Semiconductor and Pan-Semiconductor Processes 
[Sep 18, 2025]
[Sep 18, 2025] Product Description Product Usage: It is used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment. Features: 1. ...
17987. Energy Preserving Environmental Protection Copper Slurry Sintering Furnace [Sep 18, 2025]
[Sep 18, 2025] Product Description Operating Temp. RT-900°C Sintering Atmosphere Nitrogen gas (O2 content: 30-300ppm controlled) Heating Element FEC ceramic heater Control Zones 5-16 independent temperature ...
17988. UV Laser Fiber Flying Marking Engraving Machine for Mark Different Characters/Symbols/Pictures [Sep 18, 2025]
[Sep 18, 2025] Product Description Brief Description For white plastic caps, marking QR with size 11mm*11mm, marking contents is less than 35 characters, this system efficiency is about 600-800pcs/minute. Real productivity will ...
17989. Vacuum Eutectic Welding Furnace Vsr-8 for High-End Semiconductor Device Chip Packaging Applications [Sep 18, 2025]
[Sep 18, 2025] Product Description Vacuum eutectic welding furnace VSR-8 The classic designed vacuum eutectic reflow soldering system can be equipped with mature technology for formic acid oxidation suitable for low-temperature solder ...
17990. High-Precision Real-Time Detection Laser Drilling Machine for Circuit Board [Sep 18, 2025]
[Sep 18, 2025] Product Description Product advantages using the high-speed laser drilling control system of acousto-optic devices real-time detection rapid zoom within 100ns level can change laser spot energy density and ...
17991. Integrated Human-Machine Operating System Fully Automatic Oxidation Diffusion Lpcvd Furnace [Sep 18, 2025]
[Sep 18, 2025] Product Description Product Usage: This product is mainly oriented to the field of SIC power device manufacturing. The SIC/PI composite film is carbonized at 600-1050°C in a nitrogen atmosphere. During the ...
17992. Box Type High-Temperature Furnace Instrument for Powder/Ceramic Sintering/ Quality Testing [Sep 18, 2025]
[Sep 18, 2025] Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation material insulation, fast heating, strong thermal shock ...
17993. Ssx-Pecvd Tube Type Automatic Loading and Unloading Wafer Machine [Sep 18, 2025]
[Sep 18, 2025] Product Description G Texturing And Etching Automatic Loading And Unloading Machine Use Of Equipment: Automatic loading of stacked silicon wafers for texturing process Main Technical Parameter Capacity(2 ...
17994. High Speed Flying Lase Marking Printing Machine for Plastic/PE Bottle/Package Bag [Sep 18, 2025]
[Sep 18, 2025] Product Description Brief Description UV series products can be used on most materials on normal 3rd level flight marking, especially useful on materials like: plastic, PE Bottle, package bag, PVC pipe line, etc. ...
17995. Real-Time Feedback of Processing Status High Precision Laser Cutting Equipment [Sep 18, 2025]
[Sep 18, 2025] Product Description Product overview: MPS-0606LM is a product specially for the small format precision laser cutting market. It is mainly used for cutting metal sheets and ceramic substrates, with a closed ...
17996. Fiber Laser Cutting Machine for Various Alloy Materials Pipe [Sep 18, 2025]
[Sep 18, 2025] Fiber Laser Cutting Machine for Various Alloy Materials Pipe Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine ...
17997. Semiconductor Low-Temperature Baking/Drying Equipment Fully Automatic Vacuum Vertical Oven [Sep 18, 2025]
[Sep 18, 2025] Product Description Product Usage: It is used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment. Features: 1. ...
17998. Wafer Substrate Bonder Machine with Automatic Optical Focusing Integration Technology [Sep 18, 2025]
[Sep 18, 2025] Product Description DPS-04 Product advantages High resolution optical lens improves line quality Automatic optical focusing integration technology to overcome the uneven thickness of the board Advanced air float ...
17999. High Resolution Optical Lens Improves Line Quality Wafer Bonding Machine [Sep 18, 2025]
[Sep 18, 2025] Product Description DPS-04 Product advantages High resolution optical lens improves line quality Automatic optical focusing integration technology to overcome the uneven thickness of the board Advanced air float ...
18000. Automatic Generation of Printing Information IC Laser Marking Machine on Production Line [Sep 18, 2025]
[Sep 18, 2025] Product Description Laser IC Marking Equipment Equipment features: 1. Support MES Mark module system 2. Mark Auto download 3. Automatic generation of printing information 4. Supports Mark 2D ...
