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Advanced IC Laser Marking Machine for Automatic Printing Solutions
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16171.

Advanced IC Laser Marking Machine for Automatic Printing Solutions Open Details in New Window [Dec 13, 2025]

Product Description Laser IC Marking Equipment Equipment features: 1. Support MES Mark module system 2. Mark Auto download 3. Automatic generation of printing information 4. Supports Mark 2D functionality 5. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Cutting Equipment with Imported Servo Drives, Customized Systems, and Other Configurations
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16172.

Laser Cutting Equipment with Imported Servo Drives, Customized Systems, and Other Configurations Open Details in New Window [Dec 13, 2025]

Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Automated Laser Marking System for Industrial Use
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16173.

High-Precision Automated Laser Marking System for Industrial Use Open Details in New Window [Dec 13, 2025]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Slicing Machine for Sic Ingot Third-Generation Semiconductor Sic Ingot Laser Slicing
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16174.

Laser Slicing Machine for Sic Ingot Third-Generation Semiconductor Sic Ingot Laser Slicing Open Details in New Window [Dec 13, 2025]

Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision CO2 Laser Engraver for Food Packaging Solutions
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16175.

High-Precision CO2 Laser Engraver for Food Packaging Solutions Open Details in New Window [Dec 13, 2025]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced CCD Glue Dispenser with Visual Inspection System
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16176.

Advanced CCD Glue Dispenser with Visual Inspection System Open Details in New Window [Dec 13, 2025]

Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 Control Industrial personal computer + motion ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Eutectic Wafer Production Machine for Precision Manufacturing
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16177.

Advanced Eutectic Wafer Production Machine for Precision Manufacturing Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Industrial Specialized Glass-to-Metal Seal High Temperature Muffle Furnace
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16178.

Industrial Specialized Glass-to-Metal Seal High Temperature Muffle Furnace Open Details in New Window [Dec 13, 2025]

Product Description 1,Technical indicators The use of temperature RT-1100 C The uniformity of the furnace is better than that of 2 C Network belt running speed 20-150mm/min stepless adjustable The adjustable ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced High-Precision Automatic Die Bonder for LED Packaging
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16179.

Advanced High-Precision Automatic Die Bonder for LED Packaging Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y&le;&plusmn;25um,&theta;<&plusmn;3&deg; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Speed Precision Glue Dispensing Machine for SMT Applications
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16180.

High-Speed Precision Glue Dispensing Machine for SMT Applications Open Details in New Window [Dec 13, 2025]

Product Description 1. WINDOWS operating system - Using computer control, fault sound and light alarm and menu display 2. CCD visual positioning system 3. Adopt linear motor + motion control card 4. Modular ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Power Fiber Laser Engraving Machine for Brass & Metals
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16181.

High-Power Fiber Laser Engraving Machine for Brass & Metals Open Details in New Window [Dec 13, 2025]

Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, irregular surface, smoothness and fineness such as clock and watch ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making
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16182.

Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y&le;&plusmn;25um,&theta;<&plusmn;3&deg; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced High Efficiency Die Bonding Machine for Precise Chip Placement
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16183.

Advanced High Efficiency Die Bonding Machine for Precise Chip Placement Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Precision Chip Mounting Solutions for Manufacturing Efficiency
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16184.

Advanced Precision Chip Mounting Solutions for Manufacturing Efficiency Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
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16185.

China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports 1X2,1X4,2x2,2x4 Index time <400ms UPH ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.