Jiangsu Profile
Product List
16171. Advanced IC Laser Marking Machine for Automatic Printing Solutions 
[Dec 13, 2025]
[Dec 13, 2025] Product Description Laser IC Marking Equipment Equipment features: 1. Support MES Mark module system 2. Mark Auto download 3. Automatic generation of printing information 4. Supports Mark 2D functionality 5. ...
16172. Laser Cutting Equipment with Imported Servo Drives, Customized Systems, and Other Configurations [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D ...
16173. High-Precision Automated Laser Marking System for Industrial Use [Dec 13, 2025]
[Dec 13, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
16174. Laser Slicing Machine for Sic Ingot Third-Generation Semiconductor Sic Ingot Laser Slicing [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...
16175. High-Precision CO2 Laser Engraver for Food Packaging Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
16176. Advanced CCD Glue Dispenser with Visual Inspection System [Dec 13, 2025]
[Dec 13, 2025] Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 Control Industrial personal computer + motion ...
16177. Advanced Eutectic Wafer Production Machine for Precision Manufacturing [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
16178. Industrial Specialized Glass-to-Metal Seal High Temperature Muffle Furnace [Dec 13, 2025]
[Dec 13, 2025] Product Description 1,Technical indicators The use of temperature RT-1100 C The uniformity of the furnace is better than that of 2 C Network belt running speed 20-150mm/min stepless adjustable The adjustable ...
16179. Advanced High-Precision Automatic Die Bonder for LED Packaging [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
16180. High-Speed Precision Glue Dispensing Machine for SMT Applications [Dec 13, 2025]
[Dec 13, 2025] Product Description 1. WINDOWS operating system - Using computer control, fault sound and light alarm and menu display 2. CCD visual positioning system 3. Adopt linear motor + motion control card 4. Modular ...
16181. High-Power Fiber Laser Engraving Machine for Brass & Metals [Dec 13, 2025]
[Dec 13, 2025] Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, irregular surface, smoothness and fineness such as clock and watch ...
16182. Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
16183. Advanced High Efficiency Die Bonding Machine for Precise Chip Placement [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
16184. Advanced Precision Chip Mounting Solutions for Manufacturing Efficiency [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
16185. China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports 1X2,1X4,2x2,2x4 Index time <400ms UPH ...
