Jiangsu Profile
Product List
16096. Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making 
[Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
16097. Advanced High Efficiency Die Bonding Machine for Precise Chip Placement [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...
16098. Advanced Precision Chip Mounting Solutions for Manufacturing Efficiency [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
16099. China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports 1X2,1X4,2x2,2x4 Index time <400ms UPH ...
16100. Automatic Translational Sorting Machine Non-Standard Customized for Wafer Laser Processing [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports ...
16101. Efficient Turret System for Semiconductor Chip Handling Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...
16102. Reliable Sintering Furnace for Optimal Ceramic Substrate Production [Dec 13, 2025]
[Dec 13, 2025] Product Description 1,Technical indicators The use of temperature RT-1100 C The uniformity of the furnace is better than that of 2 C Network belt running speed 20-150mm/min stepless adjustable The adjustable ...
16103. High-Precision Strip Laser Marking Machine with Offline Control [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features Dual laser head marking Automatic loading and unloading Various templates for marking, online monitoring of marking quality Offline control mode ensures stability and printing ...
16104. High Precision Flipchip Eutectic Wafer Bonder with Die Attach [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches (8-inch kit optional) ...
16105. Advanced 20W UV Fiber Laser Marker for Metal Engraving [Dec 13, 2025]
[Dec 13, 2025] Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for ...
16106. Slkj Series High Precis Thick Film Sintering Furnace [Dec 13, 2025]
[Dec 13, 2025] Product Description Mainly used for high temperature sintering process of thick film printed circuit (resistors, conductors, glass) products, especially in the fields of chip resistors, LTCC, precision thick film ...
16107. High-Performance Sic Laser Annealing System for Wafer Processing [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two ...
16108. Efficient Rubber Discharge Furnace for Calcining Metal Carriers [Dec 13, 2025]
[Dec 13, 2025] Product Description The mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal ...
16109. Qxh-3116 Fully Automatic Lead Wedge Welding and Bonding Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production and ...
16110. High-Temperature Vertical Electric Furnace with Advanced 5g Ceramic Filter [Dec 13, 2025]
[Dec 13, 2025] Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation material insulation, fast heating, strong thermal shock ...
