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Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making
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16096.

Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y&le;&plusmn;25um,&theta;<&plusmn;3&deg; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced High Efficiency Die Bonding Machine for Precise Chip Placement
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16097.

Advanced High Efficiency Die Bonding Machine for Precise Chip Placement Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Precision Chip Mounting Solutions for Manufacturing Efficiency
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16098.

Advanced Precision Chip Mounting Solutions for Manufacturing Efficiency Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
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16099.

China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature Material handling cart Supports 1X2,1X4,2x2,2x4 Index time <400ms UPH ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Automatic Translational Sorting Machine Non-Standard Customized for Wafer Laser Processing
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16100.

Automatic Translational Sorting Machine Non-Standard Customized for Wafer Laser Processing Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1&times;4 mode Test mode Room temperature Material handling cart Supports ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Efficient Turret System for Semiconductor Chip Handling Solutions
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16101.

Efficient Turret System for Semiconductor Chip Handling Solutions Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test station and interface 4 test ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Reliable Sintering Furnace for Optimal Ceramic Substrate Production
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16102.

Reliable Sintering Furnace for Optimal Ceramic Substrate Production Open Details in New Window [Dec 13, 2025]

Product Description 1,Technical indicators The use of temperature RT-1100 C The uniformity of the furnace is better than that of 2 C Network belt running speed 20-150mm/min stepless adjustable The adjustable ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Strip Laser Marking Machine with Offline Control
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16103.

High-Precision Strip Laser Marking Machine with Offline Control Open Details in New Window [Dec 13, 2025]

Product Description Product Features Dual laser head marking Automatic loading and unloading Various templates for marking, online monitoring of marking quality Offline control mode ensures stability and printing ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High Precision Flipchip Eutectic Wafer Bonder with Die Attach
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16104.

High Precision Flipchip Eutectic Wafer Bonder with Die Attach Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip size 0.5X0.5-14X14mm Wafer size 12 inches (8-inch kit optional) ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced 20W UV Fiber Laser Marker for Metal Engraving
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16105.

Advanced 20W UV Fiber Laser Marker for Metal Engraving Open Details in New Window [Dec 13, 2025]

Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Slkj Series High Precis Thick Film Sintering Furnace
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16106.

Slkj Series High Precis Thick Film Sintering Furnace Open Details in New Window [Dec 13, 2025]

Product Description Mainly used for high temperature sintering process of thick film printed circuit (resistors, conductors, glass) products, especially in the fields of chip resistors, LTCC, precision thick film ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Performance Sic Laser Annealing System for Wafer Processing
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16107.

High-Performance Sic Laser Annealing System for Wafer Processing Open Details in New Window [Dec 13, 2025]

Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology with IP Green/UV laser two ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Efficient Rubber Discharge Furnace for Calcining Metal Carriers
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16108.

Efficient Rubber Discharge Furnace for Calcining Metal Carriers Open Details in New Window [Dec 13, 2025]

Product Description The mesh belt type adhesive discharge sintering furnace is applied to the adhesive discharge sintering of thick film circuits for ceramic substrate printing; Drying and calcination of metal ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Qxh-3116 Fully Automatic Lead Wedge Welding and Bonding Machine
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16109.

Qxh-3116 Fully Automatic Lead Wedge Welding and Bonding Machine Open Details in New Window [Dec 13, 2025]

Product Description Lead wire bonding technology is one of the most critical process technologies in microwave hybrid assembly technology. With the significant increase in microwave integrated component production and ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Temperature Vertical Electric Furnace with Advanced 5g Ceramic Filter
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16110.

High-Temperature Vertical Electric Furnace with Advanced 5g Ceramic Filter Open Details in New Window [Dec 13, 2025]

Product Description The FMJ series high-temperature box furnace adopts imported inorganic vacuum adsorption ceramic fiber furnace, multi-layer insulation material insulation, fast heating, strong thermal shock ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.