Jiangsu Profile
Product List
16081. High-Precision Automatic Laser Trimming Machine for PCB Applications 
[Dec 13, 2025]
[Dec 13, 2025] Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit function trimming . The high-precision laser trimming automation ...
16082. Precision Cutting and Trenching Machine for Fpcba and PCBA [Dec 13, 2025]
[Dec 13, 2025] Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...
16083. High-Precision Laser Marking System for Large PCBA Applications [Dec 13, 2025]
[Dec 13, 2025] Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers. ...
16084. Advanced Fully Automatic Wafer ID Marking Machine for Semiconductor Materials [Dec 13, 2025]
[Dec 13, 2025] Product Description Fully automatic wafer ID marking equipment Equipment features: Adopting high-precision two-dimensional linear motor platform, DD motor wafer dual arm handling robot, fully automatic visual ...
16085. High-Precision Cutting and Drilling Machine for Advanced Ceramics [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...
16086. Advanced IC Laser Marking Machine for Automatic Printing Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description Laser IC Marking Equipment Equipment features: 1. Support MES Mark module system 2. Mark Auto download 3. Automatic generation of printing information 4. Supports Mark 2D functionality 5. ...
16087. Laser Cutting Equipment with Imported Servo Drives, Customized Systems, and Other Configurations [Dec 13, 2025]
[Dec 13, 2025] Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D ...
16088. High-Precision Automated Laser Marking System for Industrial Use [Dec 13, 2025]
[Dec 13, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
16089. Laser Slicing Machine for Sic Ingot Third-Generation Semiconductor Sic Ingot Laser Slicing [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...
16090. High-Precision CO2 Laser Engraver for Food Packaging Solutions [Dec 13, 2025]
[Dec 13, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
16091. Advanced CCD Glue Dispenser with Visual Inspection System [Dec 13, 2025]
[Dec 13, 2025] Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 Control Industrial personal computer + motion ...
16092. Advanced Eutectic Wafer Production Machine for Precision Manufacturing [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...
16093. Industrial Specialized Glass-to-Metal Seal High Temperature Muffle Furnace [Dec 13, 2025]
[Dec 13, 2025] Product Description 1,Technical indicators The use of temperature RT-1100 C The uniformity of the furnace is better than that of 2 C Network belt running speed 20-150mm/min stepless adjustable The adjustable ...
16094. Advanced High-Precision Automatic Die Bonder for LED Packaging [Dec 13, 2025]
[Dec 13, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
16095. High-Speed Precision Glue Dispensing Machine for SMT Applications [Dec 13, 2025]
[Dec 13, 2025] Product Description 1. WINDOWS operating system - Using computer control, fault sound and light alarm and menu display 2. CCD visual positioning system 3. Adopt linear motor + motion control card 4. Modular ...
