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Precision Cutting and Trenching Machine for Fpcba and PCBA
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16081.

Precision Cutting and Trenching Machine for Fpcba and PCBA Open Details in New Window [Dec 13, 2025]

Product Description Brief Description 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Laser Marking System for Large PCBA Applications
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16082.

High-Precision Laser Marking System for Large PCBA Applications Open Details in New Window [Dec 13, 2025]

Product Description Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Fully Automatic Wafer ID Marking Machine for Semiconductor Materials
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16083.

Advanced Fully Automatic Wafer ID Marking Machine for Semiconductor Materials Open Details in New Window [Dec 13, 2025]

Product Description Fully automatic wafer ID marking equipment Equipment features: Adopting high-precision two-dimensional linear motor platform, DD motor wafer dual arm handling robot, fully automatic visual ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Cutting and Drilling Machine for Advanced Ceramics
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16084.

High-Precision Cutting and Drilling Machine for Advanced Ceramics Open Details in New Window [Dec 13, 2025]

Product Description Product Features High peak power fiber laser.Stable and reliable. Long service life Laser waveform segmentation editing patented technology One machine for multiple applications of drilling, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced IC Laser Marking Machine for Automatic Printing Solutions
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16085.

Advanced IC Laser Marking Machine for Automatic Printing Solutions Open Details in New Window [Dec 13, 2025]

Product Description Laser IC Marking Equipment Equipment features: 1. Support MES Mark module system 2. Mark Auto download 3. Automatic generation of printing information 4. Supports Mark 2D functionality 5. ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Cutting Equipment with Imported Servo Drives, Customized Systems, and Other Configurations
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16086.

Laser Cutting Equipment with Imported Servo Drives, Customized Systems, and Other Configurations Open Details in New Window [Dec 13, 2025]

Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance fiber laser cutting machine tailored for the metal cutting and forming market. The MPS-D ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision Automated Laser Marking System for Industrial Use
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16087.

High-Precision Automated Laser Marking System for Industrial Use Open Details in New Window [Dec 13, 2025]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Laser Slicing Machine for Sic Ingot Third-Generation Semiconductor Sic Ingot Laser Slicing
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16088.

Laser Slicing Machine for Sic Ingot Third-Generation Semiconductor Sic Ingot Laser Slicing Open Details in New Window [Dec 13, 2025]

Product Description Equipment features: 1. High dynamic and high-power femtosecond laser 2. High precision optical scanning processing system 3. High flexibility and high efficiency stripping system 4. Smooth ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Precision CO2 Laser Engraver for Food Packaging Solutions
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16089.

High-Precision CO2 Laser Engraver for Food Packaging Solutions Open Details in New Window [Dec 13, 2025]

Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced CCD Glue Dispenser with Visual Inspection System
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16090.

Advanced CCD Glue Dispenser with Visual Inspection System Open Details in New Window [Dec 13, 2025]

Product Description Specifications TSV-200D HSV-200D Dimension (mm) L1120×W740×H760 L1200×W740×H146 Weight (kg) 100 130 Control Industrial personal computer + motion ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced Eutectic Wafer Production Machine for Precision Manufacturing
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16091.

Advanced Eutectic Wafer Production Machine for Precision Manufacturing Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Industrial Specialized Glass-to-Metal Seal High Temperature Muffle Furnace
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16092.

Industrial Specialized Glass-to-Metal Seal High Temperature Muffle Furnace Open Details in New Window [Dec 13, 2025]

Product Description 1,Technical indicators The use of temperature RT-1100 C The uniformity of the furnace is better than that of 2 C Network belt running speed 20-150mm/min stepless adjustable The adjustable ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

Advanced High-Precision Automatic Die Bonder for LED Packaging
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16093.

Advanced High-Precision Automatic Die Bonder for LED Packaging Open Details in New Window [Dec 13, 2025]

Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y&le;&plusmn;25um,&theta;<&plusmn;3&deg; ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Speed Precision Glue Dispensing Machine for SMT Applications
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16094.

High-Speed Precision Glue Dispensing Machine for SMT Applications Open Details in New Window [Dec 13, 2025]

Product Description 1. WINDOWS operating system - Using computer control, fault sound and light alarm and menu display 2. CCD visual positioning system 3. Adopt linear motor + motion control card 4. Modular ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

High-Power Fiber Laser Engraving Machine for Brass & Metals
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16095.

High-Power Fiber Laser Engraving Machine for Brass & Metals Open Details in New Window [Dec 13, 2025]

Product Description Brief Description The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, irregular surface, smoothness and fineness such as clock and watch ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.