Jiangsu Profile
Product List
16081. Code Characters FPC Soft Board PCBA & IC & Wafer UV Laser Marking Machine 
[Sep 18, 2025]
[Sep 18, 2025] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
16082. Dbc Sintering Furnace for Ceramic Substrate with High Temperature Anti Deformation Structure [Sep 18, 2025]
[Sep 18, 2025] Product Description 1,Technical indicators The use of temperature RT-1100 C The uniformity of the furnace is better than that of 2 C Network belt running speed 20-150mm/min stepless adjustable The adjustable ...
16083. High Quality Laser Marking Equipment with Dual Laser Head Marking [Sep 18, 2025]
[Sep 18, 2025] Product Description Product Features Dual laser head marking Automatic loading and unloading Various templates for marking, online monitoring of marking quality Offline control mode ensures stability and printing ...
16084. High Safety High Temperature Energy Incinerator for Organic Waste Gas Industry [Sep 18, 2025]
[Sep 18, 2025] Product Description 1,Scope of application The organic waste gas flow rate is 1000 ~ 10000 Nm3/h, and the concentration is higher than 3000mg/m3. 2,application area Electronic sintering waste gas, odor, ...
16085. Fhk Continuous Push Plate Furnace for Integrated Sintering Process of Electronic Components [Sep 18, 2025]
[Sep 18, 2025] Product DescriptionAs a continuous production equipment, the push plate furnace is suitable for the discharge and sintering of various molding processes such as injection, casting, dry pressing, isostatic pressing, etc. ...
16086. Interactive Optical Fiber Laser Cutting Machine for Sheet Metal Processing Industry [Sep 18, 2025]
[Sep 18, 2025] Interactive Optical Fiber Laser Cutting Machine for Sheet Metal Processing Industry Product Description MPS-3015C series super families for sheet metal processing industry tailored double drive Longmen interactive ...
16087. Wafer Stacking and Tray Die Bonder Glue Dispensing Machine for Semiconductor Making [Sep 18, 2025]
[Sep 18, 2025] Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ<±3° ...
16088. Food Processing Plant Wastewater Treatment Multi Effect Evaporation Sewage Treat Equipment [Sep 18, 2025]
[Sep 18, 2025] Product Description 1. Scope of application The mass fraction of salt content in wastewater is 3.5%-25%; the multi effect evaporator is suitable for material crystallization temperature at 45-80 C and evaporation ...
16089. Laser Marking Machine/Engraver on Metal and Non Metal Materials [Sep 18, 2025]
[Sep 18, 2025] Laser Marking Machine/Engraver on Metal and Non Metal Materials Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine ...
16090. Automatic Laser Power Drum Cutting Machine for Traditional Sheet Metal Processing [Sep 18, 2025]
[Sep 18, 2025] Automatic Laser Power Drum Cutting Machine for Traditional Sheet Metal Processing Product Description MPS-1500SL series laser processing flexible production line is the latest "fully automatic sheet metal laser ...
16091. Fully Automated Custom-Built Assembly Line Logo Laser Marking Processing Machine Laser Marker [Sep 18, 2025]
[Sep 18, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
16092. 30W Industrial CO2 Laser Marking Equipment Laser Marker Machine for ... [Sep 18, 2025]
[Sep 18, 2025] Product Description It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, ...
16093. Fully Automatic Integrated Pre-Lamination Encapsulation Machine [Sep 18, 2025]
[Sep 18, 2025] Features •Complete the processes of short-side butyl adhesive, short side insulating adhesive, short-side busbar tape, long-side conductive adhesive tape, four-side butyl adhesive tape film covering, and laminating ...
16094. CCD Automatically Improves Positioning Accuracy Automatic Testing Equipment for Automotive ... [Sep 18, 2025]
[Sep 18, 2025] Product Description Equipped with One Touch fixture UVW fine tuning platform CCD automatically improves positioning accuracy Four-wire low resistance test to detect all the hole copper missing , micro open problem ...
16095. Semiconductor Vertical Collating Machine (Wafer/Disc Handling System) [Sep 18, 2025]
[Sep 18, 2025] Product Description Semiconductor Vertical Collating Machine (Wafer/Disc Handling System) Key Features for Semiconductor Production: Ultra-Clean Material Handling Class 1000 cleanroom-compatible design Anti-static ...
