Jiangsu Profile
Product List
8326. X-ray Non-Destructive Testing Equipment 
[May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8327. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8328. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8329. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8330. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8331. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8332. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8333. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8334. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8335. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8336. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8337. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8338. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8339. Langguang Precision X-ray IC Inspection, Mi Inspection, SMT Inspection, False Soldering, Hole ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8340. Langguang Precision X-ray IC Inspection, Mi Inspection, SMT Inspection, False Soldering, Hole ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
