Jiangsu Profile
Product List
8296. Ce YAG 
[Dec 21, 2023]
[Dec 21, 2023] Introduction: The yttrium aluminate garnet crystal doped with cerium ions, abbreviated as Ce: YAG crystal with the chemical formula Ce: Y3Al5O12, is an excellent scintillation crystal material that can grow large-sized ...
Company: Nanjing Caijing Optoelectronic Technology Co., Ltd.
8297. Cr Al2O3 Ruby [Dec 21, 2023]
[Dec 21, 2023] Introduction: Chromium doped alumina crystal (Cr: Al2O3, Ruby), also known as ruby crystal, was the first solid-state laser material - first discovered by Dr. Ted Maiman in 1960. It has two wide absorption bands, ...
Company: Nanjing Caijing Optoelectronic Technology Co., Ltd.
8298. Eight Channel 24 Bit Synchronous Sampling a/D Converter [Oct 29, 2024]
[Oct 29, 2024] performance index 8-channel synchronous sampling, 24 bits, conversion rate up to 144kSPS Power supply voltage: 5V Signal to Noise Ratio (SNR): ≥ 98dB Non spurious dynamic range (SFDR): ≥ 91dB Total harmonic ...
8299. CE Atex Certified IP66 4 Gas Meter Portable Multi-Gas Detector Lel, Co, H2s, O2 [Jul 10, 2025]
[Jul 10, 2025] 
CE ATEX certified IP66 4 Gas Meter Portable Multi-Gas Detector Lel, Co, H2s, O2 Introduction H2000 portable gas detector is typical 4 gas detector for LEL, O2, H2S, CO, and it supports the continuous detection of ...
Company: Nanjing AIYI Technologies Co., Ltd.
8300. X-ray Non-Destructive Testing Equipment [Mar 26, 2025]
[Mar 26, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8301. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8302. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8303. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8304. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8305. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8306. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8307. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8308. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8309. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
8310. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
