Jiangsu Profile
Product List
23101. High Precision Die Bonding Machine for Chip Package 
[Oct 09, 2023]
[Oct 09, 2023] Product Description The EF9621 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23102. Fully Automatic Die Bonding Machine Automatic Upload and Download [Oct 09, 2023]
[Oct 09, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23103. Automatic Die Bonding Flip Chip Vs Bonding Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23104. IC Packaging Eutectic Bonding Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The EF9621 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23105. Flip Chip Package Die Bonding Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23106. Photonics Packaging Die Bonding Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23107. Multi Strip Advanced Epoxy Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23108. High Precision Chip Bonding Machine China Manufacturer [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23109. Microwave Power Eutectic Machine Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23110. Plush Chip Slippers Textile Fries Slippers - Plush Cheeseburger Slippers Novelty House Shoe [Oct 07, 2023]
[Oct 07, 2023] Brand BT Item Name Plush Toy MOQ 500PCS FOR CUSTOM, Stock LOW MOQ Size OEM Size Material Plush, PP cotton filling Color Gray,Pink,Yellow,Purple, Blue. Custom Packaging 1pc/opp bag or ...
23111. Opto-Electronics Packaging Chip Bonding Machine [Sep 21, 2023]
[Sep 21, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23112. Bozhon Semiconductor Die Attach Epoxy Machine [Sep 20, 2023]
[Sep 20, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23113. IC Packaging Die Attach Epoxy Machine [Sep 20, 2023]
[Sep 20, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23114. Fully Automatic High Precision Epoxy Die Bonding Machine [Sep 19, 2023]
[Sep 19, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23115. Multi Die Chip Epoxy Bonding Machine [Sep 19, 2023]
[Sep 19, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
