Jiangsu Profile
Product List
23041. High Precision Die Bonding and Epoxy Dispensing Systems Machine 
[Oct 25, 2023]
[Oct 25, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23042. Customized Service Automatic Eutectic Die Bonding Machine [Oct 24, 2023]
[Oct 24, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23043. Automatic and Highly Precise Multi-Chip Packaging Die Attach Machine [Oct 23, 2023]
[Oct 23, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23044. China Die Attach Machine for Chip Packaging [Oct 20, 2023]
[Oct 20, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23045. Die Bonding Machine, with The Process for Molding a Chip on Substrate [Oct 18, 2023]
[Oct 18, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23046. Submicron Placement Accuracy Die Bonder [Oct 17, 2023]
[Oct 17, 2023] Product Description The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (15-35s/pcs) and high precision (±0.5~±3μm) . This series serves functions ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23047. Precision Epoxy Die Bonding Machine China [Oct 11, 2023]
[Oct 11, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23048. Photonics Packaging Eutectic Bonding Machine Die Attach Equipment [Oct 11, 2023]
[Oct 11, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23049. Automatic Multi Die Chip Epoxy Bonding Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23050. COB (Chip on Board) Die Attach Epoxy Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23051. China Semi-Automatically Die Bonding Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23052. Bozhon Semiconductor Die Bonding Machine China Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23053. High Precision Soldering Machine Die Bonding [Oct 09, 2023]
[Oct 09, 2023] Product Description The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (15-35s/pcs) and high precision (±0.5~±3μm) . This series serves functions ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23054. High Precision Die Bonding Machine [Oct 09, 2023]
[Oct 09, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
23055. High Power Lasers Epoxy Machine China [Oct 09, 2023]
[Oct 09, 2023] Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
