Jiangsu Profile

Product List
7636. X-ray Non-Destructive Testing Equipment
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7637. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7638. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7639. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7640. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7641. Food Heavy Metal Analyzer
[Dec 25, 2022]

Product Description EDX3200S PLUS X(Food Heavy-Metal Quick Analyzer), solely produced by Jiangsu Skyray Instrument Co., Ltd., is used to achieve the fast detection of trace heavy-metal elements in food by using ...
Company: Suzhou AupsTech Co.,Ltd.
7642. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7643. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7644. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7645. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7646. Langguang Precision X-ray IC Inspection, Mi Inspection, SMT Inspection, False Soldering, Hole ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7647. Langguang Precision X-ray IC Inspection, Mi Inspection, SMT Inspection, False Soldering, Hole ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7648. Langguang Precision X-ray Bubble Cold Welding, False Welding, Crack Detection, Diode Detection, ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7649. Langguang Precision X-ray Bubble Cold Welding, False Welding, Crack Detection, Diode Detection, ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
7650. Langguang Precision X-ray Bubble, False Soldering, Cavity and Tin Connection Detection X-ray ...
[May 12, 2025]

Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
