Jiangsu Profile
Product List
74791. Precision Manual Metal Grinding Machinery with ISO9001 
[May 08, 2018]
[May 08, 2018] 1. Picture 2. Parameters Parameters Unit KGS150 Working Surface of Table mm 150×450 (5.9"×17.7") Max.Table Travel mm 480 Max.Cross Travel mm 165 Distance Between Table Surface and ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
74792. Leading Supplier of Surface Grinding Machine in China [May 08, 2018]
[May 08, 2018] 1. Picture AHR: 2-axis automatic feed hydraulic automatic longitudinal feed electronic automatic cross feed electronic rapid up and down feed 2. Parameters Parameters Unit KGS515AHR Working Surface ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
74793. Fiberglass Tailoring Mannequin for Dressmaker Lower Half Body Hanging Female Leg Sewing Mannequin ... [May 26, 2026]
[May 26, 2026] Product Name Euro-American Ladies Pant Form Main Material Filled with Firberglass MOQ 20PCS Style 1.EOblique pin 2.Filled with FRP 3.Equipped with an adjjustable metal stand Size As picture FAQ Q: ...
74794. Best Seller City Commuting Electric Scooter with H8 Series 2000W Hub Motor for Urban Adult Moped ... [May 03, 2026]
[May 03, 2026] ntroduction to the Versatile Electric Two-Wheeler In the fast-paced urban landscape, short-distance mobility demands efficiency, durability, and affordability-and this electric two-wheeler emerges as a standout ...
Company: Speedsphere International Co., Ltd
74795. Silicon Wafer Double Side Grinding Machine for IC Wafer [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
74796. Semiconductor Wafer Double Side Polishing Machine [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
74797. IC Silicon Wafer Thinning Machine High Precision [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
74798. Semiconductor Silicon Wafer Double Side Grinding Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
74799. Silicon Wafer Thinning Machine for Microelectronics [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
74800. Semiconductor Wafer Double Side Lapping Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
74801. Silicon Wafer Double Side Grinding Machine for IC Manufacturing [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
74802. Semiconductor Silicon Wafer Thinning Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
74803. IC Wafer Double Side Lapping Machine High Accuracy [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
74804. Semiconductor Silicon Wafer Double Side Grinding Machine CNC [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
74805. Silicon Wafer Thinning Machine for Semiconductor Industry [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
