Jiangsu Profile

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Product List
14356. Diagnosis Equipment Fetal Doppler
[Jun 13, 2025]
[Jun 13, 2025] Features High sensitivity water-proof probe Display with LCD FHR digital voice funtion Multiple display modes Automatic storage and play back of FHR curve Special antiskid function Technical ...
Company: Perlong Medical Equipment Co., Ltd.
14357. Medical Battery Portable Wrist Meidcal Blood Pressure Monitor Equipment with Large LCD Display ...
[Oct 13, 2025]
[Oct 13, 2025] Medical Battery Portable Wrist Meidcal Blood Pressure Monitor Equipment With Large LCD Display Screen Wrist Blood Pressure Monitor Features: 1.Small delicate design 2.Clear LCD digital display 3.It can store 99 ...
Company: Suzhou Wise Technologe Co., Ltd.
14358. OEM Steel Structure Equipment for Pelletizing Drum and Pulley for Metallurgy
[Nov 15, 2024]
[Nov 15, 2024] Product description OEM Steel structure equipment for pelletizing drum and pulley for metallurgy Main material: High tension carbon steel, forging shaft etc. Demand: precision on dimension control, experience on ...
Company: Jiangsu Qiulin Special Energy Equipment Joint Stock (Limited) Company
14359. Auto Body Repair Equipment Car Bench Body Repair Equipment
[Sep 28, 2022]
[Sep 28, 2022] Product Description Specification Company Profile Our Advantages Our service we can make the following commitment to you: 1.product quality ...
Company: SAFE AUTOMOTIVE MAINTENANCE EQUIPMENT (TAICANG)CO., Ltd.
14360. Car Body Bench Repair Equipment for Car Service Workshop
[Aug 22, 2022]
[Aug 22, 2022] Product Description Specification Company Profile Our Advantages Our service we can make the following commitment to you: 1.product quality ...
Company: SAFE AUTOMOTIVE MAINTENANCE EQUIPMENT (TAICANG)CO., Ltd.
14361. Car Body Repair Chassis Bench Equipment (SF-5000S)
[Aug 09, 2022]
[Aug 09, 2022] Product Description Specification Company Profile Our Advantages Our service we can make the following commitment to you: 1.product quality ...
Company: SAFE AUTOMOTIVE MAINTENANCE EQUIPMENT (TAICANG)CO., Ltd.
14362. Far 25.853 Part IV Osu Heat Release Rate Testing Equipment by ASTM E906
[Jul 22, 2021]
[Jul 22, 2021] Introduction: The OSU heat release rate testing equipment, originally designed by Smith of Ohio State University in 1972, became FAA's designated combustion tester. The test standards are FAR Part 25 Appendix F Part ...
Company: Advanced Instruments Co., Limited
14363. X-ray Non-Destructive Testing Equipment
[Mar 26, 2025]
[Mar 26, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14364. X-ray Non-Destructive Testing Equipment
[May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14365. X-ray Non-Destructive Testing Equipment
[May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14366. X-ray Non-Destructive Testing Equipment
[May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14367. X-ray Non-Destructive Testing Equipment
[May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14368. X-ray Non-Destructive Testing Equipment
[May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
















