Jiangsu Profile
Product List
14146. OEM Steel Structure Equipment for Pelletizing Drum and Pulley for Metallurgy 
[Nov 15, 2024]
[Nov 15, 2024] Product description OEM Steel structure equipment for pelletizing drum and pulley for metallurgy Main material: High tension carbon steel, forging shaft etc. Demand: precision on dimension control, experience on ...
Company: Jiangsu Qiulin Special Energy Equipment Joint Stock (Limited) Company
14147. Far 25.853 Part IV Osu Heat Release Rate Testing Equipment by ASTM E906 [Jul 22, 2021]
[Jul 22, 2021] Introduction: The OSU heat release rate testing equipment, originally designed by Smith of Ohio State University in 1972, became FAA's designated combustion tester. The test standards are FAR Part 25 Appendix F Part ...
Company: Advanced Instruments Co., Limited
14148. X-ray Non-Destructive Testing Equipment [Mar 26, 2025]
[Mar 26, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14149. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14150. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14151. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14152. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14153. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
14154. Steel Pipe Eddy Current Testing Equipment [Mar 14, 2018]
[Mar 14, 2018] FET-99S intelligent digital eddy current detector is suitable for online offline flaw detection on metal pipes,wire rods, steel pipe,and electromagnetic wire,copper wire,aluminum wire.It also can be suitable for ...
Company: Su Zhou Desisen Electronics Co., Ltd
