Jiangsu Profile
Product List
16906. Tymp-II Double-Head Grinding Equipment 
[Mar 29, 2019]
[Mar 29, 2019] Equipment name: TYMP-II Grinding machine Usage: The specimens used for abrading rubber, plastic or similar to a certain thickness for other test equipment to test Features: With the advantage of two grinding wheels ...
16907. Tymp-II Double Head Grinding Equipment [Jan 07, 2019]
[Jan 07, 2019] Equipment name: TYMP-II Grinding machine Usage: The specimens used for abrading rubber, plastic or similar to a certain thickness for other test equipment to test Features: With the advantage of two grinding wheel ...
16908. OEM Steel Structure Equipment for Pelletizing Drum and Pulley for Metallurgy [Nov 15, 2024]
[Nov 15, 2024] Product description OEM Steel structure equipment for pelletizing drum and pulley for metallurgy Main material: High tension carbon steel, forging shaft etc. Demand: precision on dimension control, experience on ...
Company: Jiangsu Qiulin Special Energy Equipment Joint Stock (Limited) Company
16909. Far 25.853 Part IV Osu Heat Release Rate Testing Equipment by ASTM E906 [Jul 22, 2021]
[Jul 22, 2021] Introduction: The OSU heat release rate testing equipment, originally designed by Smith of Ohio State University in 1972, became FAA's designated combustion tester. The test standards are FAR Part 25 Appendix F Part ...
Company: Advanced Instruments Co., Limited
16910. Modern Metal Laboratory Table Factory Marble Top Laboratory Equipment [Jul 05, 2023]
[Jul 05, 2023] Chemical Work Table Lab Bench, Chemistry Laboratory Equipment Overview Quick Details General Use: Commercial Furniture Type: Laboratory Furniture Mail packing:Y ...
Company: Jiangsu Cartmay Industrial Co., Ltd.
16911. X-ray Non-Destructive Testing Equipment [Mar 26, 2025]
[Mar 26, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
16912. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
16913. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
16914. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
16915. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
16916. X-ray Non-Destructive Testing Equipment [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
