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47431. Advanced Manual Wafer Film Mounter for LED and PCB Applications 
[Jul 16, 2026]
[Jul 16, 2026] Product Description The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving design significantly ...
47432. Advanced Automatic X-ray Detection System for BGA Components [Jul 16, 2026]
[Jul 16, 2026] In-line X-Ray Inspection System - Product Introduction Product Description This system is a high-precision in-line X-Ray inspection system specifically engineered for the meticulous inspection of BGA (Ball Grid ...
47433. Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging [Jul 16, 2026]
[Jul 16, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
47434. Advanced Wafer Laser Lift-off System for GaN Layer Separation [Jul 15, 2026]
[Jul 15, 2026] Product Description SLO-V3080A LED Laser Lift-Off Equipment The SLO-V3080A is a state-of-the-art laser lift-off (LLO) system engineered for high-volume, high-yield production of LED devices. It is designed to perform ...
47435. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Jul 15, 2026]
[Jul 15, 2026] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...
47436. Advanced CCD Vision Glue Dispensing System for LED and Semiconductor Potting [Jul 15, 2026]
[Jul 15, 2026] High Quality Semiconductor SMT Dispensing and Filling Machine Product Description The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated ...
47437. Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA [Jul 14, 2026]
[Jul 14, 2026] Flip chip die bonder DA1201FC Flip Chip and Die AttachX/Y placement accuracy: Flip-chip/high-precision die attach mode: ±10-15μm@3σ; Die attach mode: ±10-25μm@3σ; Specially designed for flip chip devices with low pin ...
47438. High Quality 0.8 to 25mm Chip Epoxy Die Bonder TCP/IP Factory Price [Jul 13, 2026]
[Jul 13, 2026] Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles ...
47439. Automatic High Pressure Dust Suppression Disinfection Misting Cooling System [Aug 06, 2026]
[Aug 06, 2026] Product Description Product Name Component Brand Parameters Constant Pressure Pump Unit Variable Frequency Control Cabinet NSTG Inovance PLC+ 7-inch Touch Screen + Inovance Inverter+ Basic Electrical Components Unit ...
Company: Nstg Agri-Tech Group Co., Ltd.
47440. Automatic High Pressure Misting System [Aug 06, 2026]
[Aug 06, 2026] Product Description Automatic High-Pressure misting system The Automatic High-Pressure Misting System operates on the principle of using a high-pressure pump to pressurize water to 50–70 kg (5–7 MPa), which is then ...
Company: Nstg Agri-Tech Group Co., Ltd.
47441. 304 Stainless Steel High Pressure Misting Nozzles [Aug 06, 2026]
[Aug 06, 2026] Product Description Product Name Component Brand Parameters Constant Pressure Pump Unit Variable Frequency Control Cabinet NSTG Inovance PLC+ 7-inch Touch Screen + Inovance Inverter+ Basic Electrical Components Unit ...
Company: Nstg Agri-Tech Group Co., Ltd.
47442. Quick Connect Fitting System for Misting Pipes [Aug 06, 2026]
[Aug 06, 2026] Product Description Product Name Component Brand Parameters Constant Pressure Pump Unit Variable Frequency Control Cabinet NSTG Inovance PLC+ 7-inch Touch Screen + Inovance Inverter+ Basic Electrical Components Unit ...
Company: Nstg Agri-Tech Group Co., Ltd.
47443. Anti Drip Valve Nozzles for Fogging System [Aug 06, 2026]
[Aug 06, 2026] Product Description Product Name Component Brand Parameters Constant Pressure Pump Unit Variable Frequency Control Cabinet NSTG Inovance PLC+ 7-inch Touch Screen + Inovance Inverter+ Basic Electrical Components Unit ...
Company: Nstg Agri-Tech Group Co., Ltd.
47444. Patented Constant Pressure Variable Frequency Pump [Aug 06, 2026]
[Aug 06, 2026] Product Description Product Name Component Brand Parameters Constant Pressure Pump Unit Variable Frequency Control Cabinet NSTG Inovance PLC+ 7-inch Touch Screen + Inovance Inverter+ Basic Electrical Components Unit ...
Company: Nstg Agri-Tech Group Co., Ltd.
47445. Direct Sales Intelligent Dust Suppression Efficient Convenient Agriculture Misting Spray System [Aug 06, 2026]
[Aug 06, 2026] Product Description Product Name Component Brand Parameters Constant Pressure Pump Unit Variable Frequency Control Cabinet NSTG Inovance PLC+ 7-inch Touch Screen + Inovance Inverter+ Basic Electrical Components Unit ...
Company: Nstg Agri-Tech Group Co., Ltd.
