Jiangsu Profile
Product List
20611. Independently Developed Solidification Machine Can Achieve Multiple Substrate Transportation Methods 
[Dec 25, 2023]
[Dec 25, 2023] Product Description The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
20612. Die Bonding, Process for Placing a Chip on a Package Substrate [Nov 09, 2023]
[Nov 09, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
20613. Die Bonding Machine, with The Process for Molding a Chip on Substrate [Oct 18, 2023]
[Oct 18, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
20614. High Speed Die Bonding Machine- Process for Molding a Chip on a Package Substrate [Oct 16, 2023]
[Oct 16, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
20615. Custom Machining Wear Resistance Wear Tiles CNC Machining High Alumina Al2O3 Zirconia Zro2 Ceramic ... [Oct 31, 2024]
[Oct 31, 2024] Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
20616. Mushroom Cultivation Spawn Supply Myco Bag Bulk Substrate Bags, Large 6"X5"X20" Extra Thick 80 ... [Mar 22, 2023]
[Mar 22, 2023] Mushroom Cultivation Spawn Supply Myco Bag Bulk Substrate Bags, Large 6"x5"x20" Extra Thick 80 Micron (=3 Mil) AUTOCLAVABLE MUSHROOM GROWING BAGS - Made from polyethylene (PE) plastic, these bags are designed to ...
20617. Lightweight and High Strength Cement Substrate MGO Wall Board Magnesium Board [Aug 23, 2024]
[Aug 23, 2024] YLX Phenolic Foam Board Phenolic foam board -- 100% Non Asbestos Phenolic foam board Product Description Phenolic foam board is a new fireproof building material, main materials are magnesium oxide, ...
Company: Suzhou Eron Industries Co., Ltd.
20618. Lightweight and High Strength Cement Substrate MGO Wall Board Magnesium Board [Aug 23, 2024]
[Aug 23, 2024] YLX Phenolic Foam Board Phenolic foam board -- 100% Non Asbestos Phenolic foam board Product Description Phenolic foam board is a new fireproof building material, main materials are magnesium oxide, ...
Company: Suzhou Eron Industries Co., Ltd.
20619. Hot Air Cotton Non Woven Fabric for Namofiltration Substrate [Aug 22, 2024]
[Aug 22, 2024] · Our Products------------------------------ Our products are well known for their uniform web-forming, high tensile strength, clear opacity, breathability and softness to the touch,has passed ...
20620. Fireproof MGO Substrate Floor Board [Aug 21, 2024]
[Aug 21, 2024] heavy duty fireproof mgo subfloor board Description Mgo board can be used in various of applications such as wall paneling, partition board, ceiling board, tile backing and so on. Now, we launch a new application of ...
Company: Zhangjiagang Well Young Building Material Co., Ltd.
20621. MGO Substrate Floor Board for Prefab House [Aug 21, 2024]
[Aug 21, 2024] Description WELLYOUNG MGO FLOOR BOARD is a definitive solution for the most demanding steel frame construction,prefab house,container house.It is more flexible than cement board. WELLYOUNG MGO FLOOR BOARD is an ...
Company: Zhangjiagang Well Young Building Material Co., Ltd.
20622. Good Insulation 114X114X0.5mm Aluminium Nitride Ceramic Plate Substrate Aln Sheet [Jan 09, 2023]
[Jan 09, 2023] Product Description Aluminum nitride ceramic (AlN) has excellent properties such as high thermal conductivity, high strength, high resistivity, small density, low dielectric constant, non-toxic, and thermal expansion ...
20623. Electronic Insulation 96% Alumina Ceramic Substrate Ceramic Sheet Al2O3 Plate [Jan 09, 2023]
[Jan 09, 2023] Product Description The Aluminum oxide (Al2o3 96%) ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film ...
20624. Non Woven Toe Puff Shoe Cover Substrate Making Machine [Jun 22, 2021]
[Jun 22, 2021] Middle speed needl loom -Middle speed needle punching machine Functionality & application: By means of the needle punching process, ...
20625. Nonwoven Fabric Artifical Leather Substrate Felt Production Line [Jun 22, 2021]
[Jun 22, 2021] Needle punching nonwoven production line Applications: Needle punching technology process is the very common and prevailing process in ...
