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Closed Precision Metal Fiber Laser Cutting Machine for Silicon Wafer Ceramic Substrate
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17176.

Closed Precision Metal Fiber Laser Cutting Machine for Silicon Wafer Ceramic Substrate Open Details in New Window [Oct 23, 2026]

CW-6060J Closed Precision Fiber Laser Cutting Machine CHANXAN CW-6060J fully enclosed fiber laser cutter is dedicated to semiconductor micro-processing. It adopts micron-level non-contact cold cutting technology with ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

No Burr UV Picosecond Laser Cutting Machine for PCB Ceramic Substrate
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17177.

No Burr UV Picosecond Laser Cutting Machine for PCB Ceramic Substrate Open Details in New Window [Oct 14, 2026]

Laser power 10W/30W/35W Dimensions 2200*1500*1750mm Working area 500*610mm Certification CE Positioning Accuracy ±1um Machinery Test Report Provided processing speed ≤3000mm/s Video outgoing-inspection Provided ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Electrical Insulation 95% Alumina Ceramic Substrate Aluminum Oxide Slice
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17178.

Electrical Insulation 95% Alumina Ceramic Substrate Aluminum Oxide Slice Open Details in New Window [Oct 10, 2026]

Product Description Electrical Insulation 95% Alumina Ceramic Substrate Aluminum Oxide Slice Our as fired Al2O3 substrates are often rectangular or square or round in shapes. Alumina Ceramic Substrate Higher Thermal ...

Company: Lianyungang Highborn Technology Co., Ltd.

96% 99.6%Alumina Ceramic Substrate Wafer Plate/Substrate Al2O3 Sheet
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17179.

96% 99.6%Alumina Ceramic Substrate Wafer Plate/Substrate Al2O3 Sheet Open Details in New Window [Oct 09, 2026]

Product Description Laser Scribing 96% 99.6% Al2O3 Sheet Alumina Plate Ceramic Substrate laser scribing alumina ceramic sheet 96 99.6 al2o3 ceramic substrate laser cut ceramic plate thin alumina ceramic wafer electronic ...

Company: LIANYUNGANG BAIBO NEW MATERIAL CO., LTD.

3105 H14 Uncoated Aluminum Coil for Indoor Partition and Ceiling Substrate
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17180.

3105 H14 Uncoated Aluminum Coil for Indoor Partition and Ceiling Substrate Open Details in New Window [Sep 29, 2026]

Aluminum Coil Aluminum is a lightweight, high-strength, and corrosion-resistant metal material mainly composed of aluminum elements. A small amount of alloy elements such as copper, magnesium, and manganese can be added ...

Company: Jiangsu Hongshuo Metal Technology Co., Ltd.

Picosecond Laser Machine with Double-Station for Roll-Sheet Fast Micro-Processing Ceramic Substrate
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17181.

Picosecond Laser Machine with Double-Station for Roll-Sheet Fast Micro-Processing Ceramic Substrate Open Details in New Window [Sep 24, 2026]

Picosecond Laser Machinewith Double-Sation for Roll-Sheet Fast Micro-Processing Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Nanosecond Laser Cutting Machine for Precision PCB FPC Substrate Processing CE Certified
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17182.

Nanosecond Laser Cutting Machine for Precision PCB FPC Substrate Processing CE Certified Open Details in New Window [Sep 24, 2026]

Nanosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides Nanosecond laser cutting machines, with their core advantages of high precision, high stability, and wide material adaptability, are specifically ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Nanosecond Laser Cutting Machine for PCB FPC Substrate Deviation Correction CE Certified
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17183.

Nanosecond Laser Cutting Machine for PCB FPC Substrate Deviation Correction CE Certified Open Details in New Window [Sep 24, 2026]

Nanosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides Nanosecond laser cutting machines, with their core advantages of high precision, high stability, and wide material adaptability, are specifically ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

CE UV Picosecond Laser Cutting Machine for High Speed Ceramic Substrate Slicing
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17184.

CE UV Picosecond Laser Cutting Machine for High Speed Ceramic Substrate Slicing Open Details in New Window [Sep 24, 2026]

Picsecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision cutting, ultra thin PBC ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

UV Picosecond Laser Cutting Machine for Copper Foil Substrate Fine Line Processing
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17185.

UV Picosecond Laser Cutting Machine for Copper Foil Substrate Fine Line Processing Open Details in New Window [Sep 24, 2026]

Picsecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision cutting, ultra thin PBC ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

UV Picosecond China Laser Cutting Machine for High End Electronic Package Substrate
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17186.

UV Picosecond China Laser Cutting Machine for High End Electronic Package Substrate Open Details in New Window [Sep 24, 2026]

Picsecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision cutting, ultra thin PBC ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Manufacture UV Picosecond China Laser Cutting Machine for Ceramic Substrate Work
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17187.

Manufacture UV Picosecond China Laser Cutting Machine for Ceramic Substrate Work Open Details in New Window [Sep 24, 2026]

Picsecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides comprehensive laser solutions for precision processing in the glass industry. Its core features include cold processing, high precision, low edge ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

UV Picosecond Laser Cutting Machine for Thin Silicon Substrate Cold Laser Processing
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17188.

UV Picosecond Laser Cutting Machine for Thin Silicon Substrate Cold Laser Processing Open Details in New Window [Sep 24, 2026]

Picsecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides comprehensive laser solutions for precision processing in the 3C industry, including core techniques such as FPC precision cutting, ultra thin PBC ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

UV Picosecond Laser Cutting Machine for High Density Ceramic Substrate Precision Dicing
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17189.

UV Picosecond Laser Cutting Machine for High Density Ceramic Substrate Precision Dicing Open Details in New Window [Sep 24, 2026]

Picsecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides comprehensive laser solutions for precision processing in the glass industry. Its core features include cold processing, high precision, low edge ...

Company: Chanxan (Changshu) Laser Technology Co., Ltd.

Customized 96% Alumina Ceramic Substrate Al2O3 Ceramic Plate
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17190.

Customized 96% Alumina Ceramic Substrate Al2O3 Ceramic Plate Open Details in New Window [Sep 24, 2026]

Product Description Cusotm Alumina parts Custom alumina ceramic components, also known as aluminum oxide ceramic parts, are precision advanced ceramics manufactured per your drawings or samples. Multiple purity grades ...

Company: Lianyungang Highborn Technology Co., Ltd.