Jiangsu Profile
Product List
81091. M250-200X460mm Manual Surface Grinding Machine 
[Mar 04, 2019]
[Mar 04, 2019] 1. Picture 2. Parameters Parameters Unit M250 Working Surface of Table mm 200×460 (8"×18") Max.Table Travel mm 540 Max.Cross Travel mm 240 Distance Between Table Surface and Spindle ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
81092. M Series Manual Saddle Moving Surface Grinder Machine [May 08, 2018]
[May 08, 2018] 1. Picture 2. Parameters Parameters Unit M250 Working Surface of Table mm 200×460 (8"×18") Max.Table Travel mm 540 Max.Cross Travel mm 240 Distance Between Table Surface and Spindle ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
81093. M618 Manual Metal Grinding Machinery [May 08, 2018]
[May 08, 2018] 1. Picture 2. Parameters Parameters Unit M618 Working Surface of Table mm 150×450 (5.9"×17.7") Max.Table Travel mm 480 Max.Cross Travel mm 165 Distance Between Table Surface and ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
81094. M618 Small Surface Grinding Machine for Metal Polishing [May 08, 2018]
[May 08, 2018] 1. Picture 2. Parameters Parameters Unit M618 Working Surface of Table mm 150×450 (5.9"×17.7") Max.Table Travel mm 480 Max.Cross Travel mm 165 Distance Between Table Surface and ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
81095. Mini 150X450mm M618 Surface Grinder [May 08, 2018]
[May 08, 2018] 1. Picture 2. Parameters Parameters Unit M618 Working Surface of Table mm 150×450 (5.9"×17.7") Max.Table Travel mm 480 Max.Cross Travel mm 165 Distance Between Table Surface and ...
Company: NANTONG KAITE MACHINE TOOL CO., LTD.
81096. Silicon Wafer Double Side Grinding Machine for IC Wafer [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
81097. Semiconductor Wafer Double Side Polishing Machine [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
81098. IC Silicon Wafer Thinning Machine High Precision [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
81099. Semiconductor Silicon Wafer Double Side Grinding Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
81100. Silicon Wafer Thinning Machine for Microelectronics [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
81101. Semiconductor Wafer Double Side Lapping Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
81102. Silicon Wafer Double Side Grinding Machine for IC Manufacturing [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
81103. Semiconductor Silicon Wafer Thinning Equipment [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
81104. IC Wafer Double Side Lapping Machine High Accuracy [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
81105. Semiconductor Silicon Wafer Double Side Grinding Machine CNC [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Please enter the title here Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and ...
