Jiangsu Profile
Product List
2011. N Female Flange Mount Soldering for Rg402 N-Kfb3-18 
[Jan 13, 2015]
[Jan 13, 2015] Description Type N is a kind of low to medium power connectors with screw coupling. Characteristic impedance has two types: 50Ω And 75Ω . The characteristic of connector is high reliability, great ...
2012. N Female Flange Mount Soldering Type for Rg405 N-Kfb2-2 [Jan 13, 2015]
[Jan 13, 2015] Description Type N is a kind of low to medium power connectors with screw coupling. Characteristic impedance has two types: 50Ω And 75Ω . The characteristic of connector is high reliability, great ...
2013. N Female Flange Mount Soldering Type for Rg405 N-Kfb2-3-M [Jan 13, 2015]
[Jan 13, 2015] Description Type N is a kind of low to medium power connectors with screw coupling. Characteristic impedance has two types: 50Ω And 75Ω . The characteristic of connector is high reliability, great ...
2014. Large Flow Filter Fin Soldering Machine [Jan 26, 2025]
[Jan 26, 2025] Large Flow Filter Connector Soldering Machine Product Description This equipment is a large flow filter core connecting machine, is one part of the high flow filter core production line, mainly used for connecting ...
Company: K&M Technologies Ltd.
2015. Water Filter Core Length Soldering Equipment [Jan 26, 2025]
[Jan 26, 2025] Water Filter Core Lengthening Hot Plate Soldering Equipment Product Description This machine is designed for Lengthening the pleated microporous membrane filters, one of the machines in pleated filter production ...
Company: K&M Technologies Ltd.
2016. Xbc Solar Cell Perovskite Solar Cells Soldering Ribbon Used for Solar Module/Bus-Wire [Jan 10, 2025]
[Jan 10, 2025] Product name Size Copper-base thickness Copper-base materia Tin-layer thickness(single face) Coating alloys 0.18 0.17 0.005 SnPbAg 62/36/2 SnAg 96.5/3.5 Sn 99.9 SnPb 60/40 SnPb 63/37 SnBiAg ...
2017. Solar Panel Soldering Cell Tabbing Wire Ribbon Wire Tin Coated Copper Ribbons and Bus Wire PV [Jan 10, 2025]
[Jan 10, 2025] Product Photos: Specification Width: 10~20mm Thickness: 0.1~0.13mm Mpa: ≤75 Note: Customization is available ...
2018. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2019. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2020. Langguang Precision X-ray Microfocus Ai Intelligent Computing X-ray Machine for Bubble, Cavity, ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2021. Langguang Precision Xray Soldering Cavity Bubble Lithium Battery Electrode Sheet Tab Wire Harness ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2022. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2023. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2024. Langguang Precision X-ray Inspection Machine, Industrial X-ray Inspection, BGA Soldering ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
2025. Langguang Precision X-ray BGA Soldering Inspection, Lithium Battery Electrode Sheet Inspection, LED ... [May 12, 2025]
[May 12, 2025] Applications I. BGA, QFN, CSP, and flip chip SMT industry inspection. II. Semiconductor, multilayer printed circuit board, packaging components, battery industry. III. Electronic components, LED, automotive parts, ...
