Jiangsu Profile
Product List
17326. Automatic Multi-Layar Roll Laminatin Machine with Waste Removal 
[Jun 05, 2026]
[Jun 05, 2026] Product Description Model KD-T350/450-3 KD-T350/450-4 KD-T350/450-5 Unwinding shaft 3 sets 4 sets 5 sets Rewinding shaft 3 sets 4 sets 5 sets Laminating ...
17327. Aluminum Foil Tape Laminating Machine [Jun 05, 2026]
[Jun 05, 2026] Main Parameters Model KD-T300 Max feeding width 300mm Max speed 32m/min Laminating precision ±0.1 Tension system Magnetic powder control Power ...
17328. Laminating Machine with Inspection Function [Jun 05, 2026]
[Jun 05, 2026] Main Parameters Model KD-T300 Max feeding width 300mm Max speed 32m/min Laminating precision ±0.1 Tension system Magnetic powder control Power 2kw Voltage 220V Dimension 2800*1100*1700mm Weight 500kg Features - Overall ...
17329. Roller Pet Plastic Laminating Machine [Jun 05, 2026]
[Jun 05, 2026] Main Parameters Model KD-T300 Max feeding width 300mm Max speed 32m/min Laminating precision ±0.1 Tension system Magnetic powder control Power ...
17330. PVC/Pet / Mayer Automatic Laminating Machine [Jun 05, 2026]
[Jun 05, 2026] Main Parameters Model KD-T300 Max feeding width 300mm Max speed 32m/min Laminating precision ±0.1 Tension system Magnetic powder control Power ...
17331. High-Precision Copper Foil Laminating Machine [Jun 05, 2026]
[Jun 05, 2026] Main Parameters Model KD-T300 Max feeding width 300mm Max speed 32m/min Laminating precision ±0.1 Tension system Magnetic powder control Power ...
17332. Roll Adhesive Tape Laminating Machine [Jun 05, 2026]
[Jun 05, 2026] Main Parameters Model KD-T300 Max feeding width 300mm Max speed 32m/min Laminating precision ±0.1 Tension system Magnetic powder control Power ...
17333. Ceramic Insulating Substrate UV Picosecond Laser Cutting Machine [Oct 28, 2026]
[Oct 28, 2026] Machine Introduction KEDOU UV Picosecond Laser Cutting Machine KEDOU UV picosecond laser cold processing with nearly no thermal damage. Suitable for brittle optical materials, semiconductor wafers, ...
17334. Fused Silica UV Picosecond Laser Cutting Machine [Oct 28, 2026]
[Oct 28, 2026] Machine Introduction KEDOU UV Picosecond Laser Cutting Machine KEDOU UV picosecond laser cold processing with nearly no thermal damage. Suitable for brittle optical materials, semiconductor wafers, ...
17335. Polycrystalline Silicon Infrared Picosecond Laser Cutting Machine [Oct 28, 2026]
[Oct 28, 2026] Machine Introduction KEDOU UV Picosecond Laser Cutting Machine KEDOU UV picosecond laser cold processing with nearly no thermal damage. Suitable for brittle optical materials, semiconductor wafers, ...
17336. Gold Foil UV Picosecond Laser Cutting Machine [Oct 26, 2026]
[Oct 26, 2026] Machine Introduction KEDOU UV Picosecond Laser Cutting Machine KEDOU UV picosecond laser cold processing with nearly no thermal damage. Suitable for brittle optical materials, semiconductor wafers, ...
17337. Constantan Foil UV Picosecond Laser Cutting Machine [Oct 26, 2026]
[Oct 26, 2026] Machine Introduction KEDOU UV Picosecond Laser Cutting Machine KEDOU UV picosecond laser cold processing with nearly no thermal damage. Suitable for brittle optical materials, semiconductor wafers, ...
17338. Silver Foil UV Picosecond High Precision Laser Cutting Machine [Oct 26, 2026]
[Oct 26, 2026] Machine Introduction KEDOU UV Picosecond Laser Cutting Machine KEDOU UV picosecond laser cold processing with nearly no thermal damage. Suitable for brittle optical materials, semiconductor wafers, ...
17339. Titanium Foil UV Picosecond Laser Cutting Machine [Oct 26, 2026]
[Oct 26, 2026] Machine Introduction KEDOU UV Picosecond Laser Cutting Machine KEDOU UV picosecond laser cold processing with nearly no thermal damage. Suitable for brittle optical materials, semiconductor wafers, ...
17340. Aluminum Foil UV Picosecond Laser Cutting Machine [Oct 26, 2026]
[Oct 26, 2026] Machine Introduction KEDOU UV Picosecond Laser Cutting Machine KEDOU UV picosecond laser cold processing with nearly no thermal damage. Suitable for brittle optical materials, semiconductor wafers, ...
