Jiangsu Profile
Product List
4831. 12-Inch Precision Wafer Dicing Saw for Silicon and Ceramics 
[Mar 02, 2026]
[Mar 02, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution The DS9260 is a 12-inch fully automatic precision dicing machine, featuring a high-power dual-spindle design and equipped with a ...
4832. Custom Steel Separator Disc with Rubber Bonded Steel Spacers [Feb 02, 2026]
[Feb 02, 2026] Product Description Metallurgical knife and tools are specially designed for steel processing uses in metallurgical industry, like steel sheet, steel rod and steel bar cutting, trimming, shearing, slitting or ...
4833. Porous Alumina Tube Ceramic Probe Cup with Vacuum Gauge Joint UPVC Pipe [Feb 28, 2026]
[Feb 28, 2026] The porous ceramic head is the sensor part of the instrument, porous ceramic tube has many fine pores. After the ceramic head is infiltrated by water, a water film is formed in the pores. Product Name porous ...
4834. High Temperature Furnace Used White 95% Al2O3 Alumina Ceramics S Hooks [Feb 27, 2026]
[Feb 27, 2026] High Temperature Furnace Used 95% Al2O3 Ceramics S Hooks Alumina wire guide pulley Product Description Product Name High Purity Wear Resistant Alumina Ceramic hook Material 95%/96%/99% ...
4835. Hot-Selling Mechanical Seals with High Quality and Low Price [Jan 28, 2026]
[Jan 28, 2026] Product Description Product Information Product Name Mechanical Seal Type MG1 MG13 M3N M7N H7N 560A 560D, etc. Operating limits Standard DIN24960 Pressure ≤1.0MPa Temperature ...
4836. Multi-Station Vertical Semiconductor Wafer Dryer [Feb 28, 2026]
[Feb 28, 2026] Product Description A.Equipment overview 1.1 Application Fields: It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, ...
4837. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Feb 28, 2026]
[Feb 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
4838. High-Efficiency Plasma Cleaner for Wafer Photoresist Removal Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
4839. Semiconductor Sic Sio2 Wafer Stealth Dicing Cutting Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide ...
4840. Advanced 355nm UV Laser Marking Machine for Precision Applications [Feb 28, 2026]
[Feb 28, 2026] Product Description Product Overview: Precision UV Laser Marking Machine Elevate your production line with our high-precision UV Laser Marking Machine. Designed for flawless, permanent marking on sensitive and ...
4841. Advanced Stealth Dicing Machine Solutions for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide materials. ...
4842. Advanced Qr Barcode Marking System for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] Product Description DSI-G-WMN6021-A Fully Automatic Wafer ID Marking Equipment The DSI-G-WMN6021-A is a state-of-the-art, fully automatic system designed for high-precision and high-throughput permanent marking ...
4843. Silicon Sapphire LED Solar Wafer Laser Stealth Dicing Equipment with Dry Process [Feb 28, 2026]
[Feb 28, 2026] Product Description This laser wafer modification stealth dicing equipment is designed for silicon wafers, silicon carbide (SiC) wafers, LED sapphire wafers, and solar-related semiconductor wafers, supporting ...
4844. High Precision Laser Cutting System for Semiconductor Wafers [Feb 28, 2026]
[Feb 28, 2026] Wafer Laser Cutting System Wafer Laser Cutting Equipment Wafer Laser Cutting Machine Product Description Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide ...
4845. Advanced Plasma Asher for Efficient Wafer Adhesive Removal Solutions [Feb 28, 2026]
[Feb 28, 2026] Product Description Description of Our Plasma Asher Our advanced Plasma Asher systems offer a superior, dry process for the high-precision removal of organic materials and photoresist stripping in semiconductor, MEMS, ...
