Jiangsu Semiconductor products, Jiangsu Semiconductor manufacturers & suppliers page808

12106.

Tipp112 Darlington Transistors Chips/Wafer [Aug 20, 2024]

Die Size 1.50mm×1.50mm BVCEO 100V BVCBO 150V BVEBO 6V IC 2A hFE 2000~15000 VCE(sat) 1.8V fT 10MHz Yangzhou Genesis Microelectronics Co., Ltd., a sino-foreign joint venture, is a national ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

12107.

Peek Wafer Chuck [Aug 21, 2024]

PEEK, PI has excellent electrical properties make it an excellent electrical insulator, may be in a very wide temperature, pressure and frequency fluctuation range, long-term stability. The ultra-high temperature ...

Company: Jiangsu Junhua Hpp Co., Ltd.

12108.

1A8 Resin Bond Diamond Blades [Nov 01, 2025]

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ...

Company: Taizhou Sumeng Grinding Wheel Co., Ltd.

12109.

1A8 Metal Bond Cutting Blades [Nov 01, 2025]

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ...

Company: Taizhou Sumeng Grinding Wheel Co., Ltd.

12110.

Negative Ion Needle [Aug 21, 2024]

1.what is silicon wafers and it's application: A silicon wafer is a material essential for manufacturing semiconductors, which are found in all kinds of electronic devices that enrich our lives. Silicon wafer ...

Company: Suzhou Henglixin New Material Co., Ltd.

12111.

Wafer Back & Front Wheels [Nov 01, 2025]

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ...

Company: Taizhou Sumeng Grinding Wheel Co., Ltd.

12112.

Eletroformed Hubless Dicing Blades [Nov 01, 2025]

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ...

Company: Taizhou Sumeng Grinding Wheel Co., Ltd.

12113.

Diamond Blades with Cores [Nov 01, 2025]

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ...

Company: Taizhou Sumeng Grinding Wheel Co., Ltd.

12114.

Custom High Precision Ceramic Capillary for Semiconductor Wire Bonding IC Packaging [Apr 23, 2026]

Taomsun high-precision ceramic capillaries are custom-designed for semiconductor IC packaging and wire bonding processes. These capillaries support gold, silver, copper, and aluminum wire bonding applications, featuring ...

Company: Suzhou Taomsun Scientific Instruments Co., Ltd