Jiangsu Profile
Product List
85666. Precision Spring Energized Seal for Waterjet Cutters with 100mm Fit 
[Sep 02, 2026]
[Sep 02, 2026] Specification Inner diameter range 6mm~150mm Fit plunger diameter 10mm~100mm Temperature range -40℃~+120℃ Groove gap ≤0.05mm Section diameter range 3mm~12mm Material Seal Body: Modified PEEK / High-strength Filled PTFE ...
Company: Taizhou Lianghao Electromechanical Equipment Co., Ltd.
85667. PTFE Seal for Waterjet Cutters with 6mm to 150mm Diameter [Sep 02, 2026]
[Sep 02, 2026] Specification Inner diameter range 6mm~150mm Fit plunger diameter 10mm~100mm Temperature range -40℃~+120℃ Groove gap ≤0.05mm Section diameter range 3mm~12mm Material Seal Body: Modified PEEK / High-strength Filled PTFE ...
Company: Taizhou Lianghao Electromechanical Equipment Co., Ltd.
85668. Spring Energized Seal for Hydraulic Applications in Waterjet Cutters [Sep 02, 2026]
[Sep 02, 2026] Specification Inner diameter range 6mm~150mm Fit plunger diameter 10mm~100mm Temperature range -40℃~+120℃ Groove gap ≤0.05mm Section diameter range 3mm~12mm Material Seal Body: Modified PEEK / High-strength Filled PTFE ...
Company: Taizhou Lianghao Electromechanical Equipment Co., Ltd.
85669. Waterjet Cutter Seal with Spring Energized PTFE Material for Durability [Sep 02, 2026]
[Sep 02, 2026] Specification Inner diameter range 6mm~150mm Fit plunger diameter 10mm~100mm Temperature range -40℃~+120℃ Groove gap ≤0.05mm Section diameter range 3mm~12mm Material Seal Body: Modified PEEK / High-strength Filled PTFE ...
Company: Taizhou Lianghao Electromechanical Equipment Co., Ltd.
85670. Spring Energized Seal for Waterjet Cutters with 150mm Inner Diameter [Sep 02, 2026]
[Sep 02, 2026] Specification Inner diameter range 6mm~150mm Fit plunger diameter 10mm~100mm Temperature range -40℃~+120℃ Groove gap ≤0.05mm Section diameter range 3mm~12mm Material Seal Body: Modified PEEK / High-strength Filled PTFE ...
Company: Taizhou Lianghao Electromechanical Equipment Co., Ltd.
85671. Spring Oil Seal for Waterjet Cutters with 10mm to 100mm Plunger [Sep 02, 2026]
[Sep 02, 2026] Specification Inner diameter range 6mm~150mm Fit plunger diameter 10mm~100mm Temperature range -40℃~+120℃ Groove gap ≤0.05mm Section diameter range 3mm~12mm Material Seal Body: Modified PEEK / High-strength Filled PTFE ...
Company: Taizhou Lianghao Electromechanical Equipment Co., Ltd.
85672. Prefabricated Structural Steel Frame Part for Prefab Steel Structure Building [Aug 17, 2026]
[Aug 17, 2026] Hehua Factory Products Specification Material Hardened Metals, Precious Metals, Stainless steel, Carbon steel Surface treatment Powder coating, electroplating, oxide,anodization Technics laser cut, bend, weld, assembled ...
85673. Fast Accurate Coating Thickness Gauge Non Destructive Coating Thickness Gauge T450 [Jul 22, 2026]
[Jul 22, 2026] Product Description Item Name Specifications QTY Unit Hardware Configure Micro-focusing enhanced ray tube / 1 set Optical collimator φ0.3mm, φ0.2mm, φ0.5mm (Only one) 1 set Si-Pin semiconductor detector / 1 set Main ...
Company: JSPEC INSTRUMENT CO., LTD
85674. IC Silicon Wafer Grinding Machine High Flatness [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...
85675. IC Wafer Surface Grinding Machine for Precision Processing [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...
85676. Silicon Wafer Grinding Machine for Microelectronics Industry [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...
85677. IC Silicon Wafer Grinding Machine for Thickness Control [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...
85678. Silicon Wafer Grinding Equipment for IC Manufacturing [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...
85679. IC Wafer Surface Polishing Machine for Precision Processing [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Variable frequency control enables soft start and soft stop, minimizing impact and workpiece damage. 2. Timer function controls ...
85680. IC Silicon Wafer Polishing Machine for Clean Room Use [Apr 25, 2026]
[Apr 25, 2026] Production process Can build a complete silicon wafer production line Equipment Features 1. Variable frequency control enables soft start and soft stop, minimizing impact and workpiece damage. 2. Timer function controls ...
