Jiangsu Profile
Product List
7891. Advanced High-Precision Fiber Laser Cutter for Metal Sheets 
[Apr 07, 2026]
[Apr 07, 2026] Mps-6020d Fiber Laser Cutting Machine for The Large-Scale Sheet Metal Processing Industry Product Description Product Introduction: The MPS-D series laser cutting machine is a high configuration and high-performance ...
7892. Advanced Manual Wafer Film Mounter for LED and PCB Applications [Mar 16, 2026]
[Mar 16, 2026] Product Description The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving design significantly ...
7893. Precision Engineering IC Wafer Alignment Tools for Optimal Performance [Mar 10, 2026]
[Mar 10, 2026] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
7894. Advanced Qr Code Marking System for Semiconductor Wafers [Mar 10, 2026]
[Mar 10, 2026] Product Description DSI-G-WMN6021-A Fully Automatic Wafer ID Marking Equipment The DSI-G-WMN6021-A is a state-of-the-art, fully automatic system designed for high-precision and high-throughput permanent marking ...
7895. High-Precision 20W Fiber Laser Marking Machine for PCB Engraving [Mar 10, 2026]
[Mar 10, 2026] Product Description Brief Description 1. Various metal materials, part of non-metal materials. 2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for ...
7896. Precision Carbon Dioxide Laser Engraving Tool for Artisans [Mar 10, 2026]
[Mar 10, 2026] Product Description Applications: The carbon dioxide laser marking machine can engrave a variety of non-metallic materials, and is widely used in craft gifts, fixtures, leather clothing, advertising signs, ...
7897. 12-Inch Precision Wafer Dicing Saw for Silicon and Ceramics [Mar 02, 2026]
[Mar 02, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution The DS9260 is a 12-inch fully automatic precision dicing machine, featuring a high-power dual-spindle design and equipped with a ...
7898. Professional Glass Cutter for Smartphone and Tablet Repairs [Mar 02, 2026]
[Mar 02, 2026] Product Description Model NO. Himalaya-6688-008 Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Mould Life >1,000,000 ...
7899. Versatile Silicone Bonding Agent for Electronic Device Manufacturing [Mar 02, 2026]
[Mar 02, 2026] High quality Automatic Silicone Glue Dispensing Equipment for Semiconductor Industry Product Description Certification CE Warranty 1 year Automatic Grade Automatic Installation Desktop Driven Type Electricity ...
7900. Precision UV Laser Cutter for High-Quality OLED Film Production [Feb 28, 2026]
[Feb 28, 2026] Product Description Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, ...
7901. Advanced Laser Marking System for Precision Wafer Solutions [Feb 28, 2026]
[Feb 28, 2026] High Standard UV Laser Marking Machine for Food, PVC Pipe, Medicine Packaging Material Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, ...
7902. Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt [Feb 28, 2026]
[Feb 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
7903. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Feb 28, 2026]
[Feb 28, 2026] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
7904. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Feb 28, 2026]
[Feb 28, 2026] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...
7905. Semiconductor Sic Sio2 Wafer Stealth Dicing Cutting Equipment [Feb 28, 2026]
[Feb 28, 2026] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide ...
