Jiangsu Profile
Product List
6406. Advanced Laser Wafer Marking Machine for Semiconductor Production 
[Dec 13, 2025]
[Dec 13, 2025] Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System The Wafer Marking Machine is a high-precision, automated system designed for the laser marking of semiconductor wafers with 8-12-inch ...
6407. Manual Vacuum Wafer Laminator Mounting Machine for Semiconductor Wafer Thinning [Dec 13, 2025]
[Dec 13, 2025] Product Description Parameter Dimension L933*W450*H317mm Compatible size 6"~8" Total power 500W Input power supply 100-240V AC 50-60HZ Air pressure 0.5-0.8Mpa Film type Blue film/UV film Plate heating temperature 0~65ºC ...
6408. Advanced Laser Marking System for Precision Wafer Solutions [Dec 13, 2025]
[Dec 13, 2025] High Standard UV Laser Marking Machine for Food, PVC Pipe, Medicine Packaging Material Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, ...
6409. Subsurface Laser Modification and Precision Dicing Machine for Semiconductor Wafers Sic/GaN/Ln/Lt [Dec 13, 2025]
[Dec 13, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
6410. Advanced High-Precision Laser Marking System for PCB Manufacturing [Dec 13, 2025]
[Dec 13, 2025] High Quality PCB laser marking system Product Description This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA standard ...
6411. Achieve Perfect Alignment with Precision Wafer Mounting Equipment System [Dec 13, 2025]
[Dec 13, 2025] Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure ...
6412. High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device [Dec 13, 2025]
[Dec 13, 2025] High Precision Wafer Thinning Machine Grinding Equipment Manufacturers industrial Automation device Product Description High precision grinding machine equipment principle: 1. This series of transverse ...
6413. Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing [Dec 13, 2025]
[Dec 13, 2025] Introducing Our Advanced Subsurface Laser Modification and Precision Dicing Systems Optimized for Compound Semiconductor Wafers (SiC/GaN) and Piezoelectric Crystals (LN/LT) Key Technology Highlights Custom Laser System ...
6414. Gold Silver Jewelry Fiber Marking or Engraving Machine [Dec 13, 2025]
[Dec 13, 2025] Product Description Introducing Our High-Precision Fiber Laser Marking Machine Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable ...
6415. High Precision UV Laser Marking Machine for Electronics [Dec 13, 2025]
[Dec 13, 2025] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, ...
6416. Semiconductor Sic Sio2 Wafer Stealth Dicing Cutting Equipment [Dec 13, 2025]
[Dec 13, 2025] Product Description Complete SiC (Silicon Carbide) Wafer Laser Cutting Solution This integrated solution is engineered for high-precision, high-efficiency, and high-yield processing of brittle silicon carbide ...
6417. Advanced Precision Positioning Equipment for PCBA and IC Wafers [Dec 13, 2025]
[Dec 13, 2025] Product Description Brief Description The equipment can realize automatic loading and unloading for stacked FPC, automatic positioning and marking, automatic code reading and proofreading, automatic transfer of ...
6418. High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor [Dec 13, 2025]
[Dec 13, 2025] Product Description Wafer dicing machine for semiconductor equipment Wafer Dicing Machine The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, ...
6419. High Quality Laser Making/Markig Machine for FPC/PCB Board with Innovative Processing Technology [Dec 13, 2025]
[Dec 13, 2025] Product Description Brief Description 1. Marking of electronic products' LOGO, model, place of origin and so on. 2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole ...
6420. 80W Mopa High-Precision CCD Vision Positioning Laser Scribing Machine for Wafer [Dec 13, 2025]
[Dec 13, 2025] Product Description High-Precision Laser Scribing Machine for Superior Wafer Yield Our SHL2-4000V19 Laser Scribing Machine represents the pinnacle of efficiency and precision in solar cell production. Designed for ...
