Jiangsu Profile
Product List
34516. Semiconductor Wafer Edge Processing System for IC Industry 
[May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Equipment Principle The equipment utilizes a high-speed rotating grinding head to chamfer the edges of the wafer. The wafer is placed and fixed on a ...
34517. Semiconductor Wafer Chamfering Equipment for High Precision Fab [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Equipment Principle The equipment utilizes a high-speed rotating grinding head to chamfer the edges of the wafer. The wafer is placed and fixed on a ...
34518. Njbinglab 5L PFA Beaker with Handle - Large Capacity, Chemical-Resistant for Lab & Semiconductor Use [May 26, 2025]
[May 26, 2025] Company Profile Nanjing Binzhenghong Instrument Co.,Ltd is a professional laboratory product manufacturer which mainly has laboratory products based on PTFE/PFA/FEP and other materials, such as: beaker/reagent ...
34519. High-Purity PFA Flared Joint for Semiconductor Solar Photovoltaic Industry [Nov 20, 2023]
[Nov 20, 2023] Nanjing Binzhenghong Instrument Co.,Ltd is a professional laboratory product manufacturer which mainly has laboratory products based on PTFE/PFA/FEP and other materials, such as: beaker/reagent bottle/stirring ...
34520. 5lpfa Sample Bottle Semiconductor Electronic Grade Sampling Bottle [Nov 08, 2023]
[Nov 08, 2023] Nanjing Binzhenghong Instrument Co.,Ltd is a professional laboratory product manufacturer which mainly has laboratory products based on PTFE/PFA/FEP and other materials, such as: beaker/reagent bottle/stirring ...
34521. IC Wafer Thinning Machine for Semiconductor Processing [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
34522. Semiconductor Silicon Wafer Grinding Machine for Clean Surface [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
34523. Semiconductor Silicon Wafer Thinning Machine High Precision [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
34524. Semiconductor Silicon Wafer Double Side Polishing Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
34525. Semiconductor Silicon Wafer Thinning Equipment [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
34526. Semiconductor Wafer Double Side Lapping Equipment [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
34527. Semiconductor Silicon Wafer Thinning Equipment Supplier [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
34528. Semiconductor Silicon Wafer Double Side Grinding Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
34529. Semiconductor Silicon Wafer Double Side Grinding Machine CNC [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
34530. Semiconductor Wafer Double Side Polishing Machine [May 27, 2026]
[May 27, 2026] Production process Can build a complete silicon wafer production line Thinning machine can achieve integrated rough grinding and fine grinding. 1. The lower spindle carries the product and switches between rough ...
