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N1.4 4 Inch Power Transistor Chips/Diced Silicon Wafer

23611.

N1.4 4 Inch Power Transistor Chips/Diced Silicon Wafer Open Details in New Window [Dec 09, 2020]

Die Size 1400μ m×1400μ m Size of Bonding Pad Base 429μ m×615μ m Emitter 424μ m×550μ m Thickness 240±10μm Scribe Width 80μm Metallization Front: Al ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

P1.4 4 Inch Power Transistor Chips/Diced Silicon Wafer

23612.

P1.4 4 Inch Power Transistor Chips/Diced Silicon Wafer Open Details in New Window [Dec 09, 2020]

Die Size 1400μ m×1400μ m Size of Bonding Pad Base 429μ m×615μ m Emitter 424μ m×550μ m Thickness 240±10μm Scribe Width 80μm Metallization Front: Al ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

Jcr0044p (SN) Thyristor Element Silicon Wafer

23613.

Jcr0044p (SN) Thyristor Element Silicon Wafer Open Details in New Window [Dec 09, 2020]

Die Size 440μ m×440μ m Size of Bonding Pad Controlling 115μ m×115μ m Cathode: 190×190×3/4µm2 Thickness 220±20μm Known Good Dies 36300 Metallization ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

Jcr0150b 4-Inch SCR Chips Diced Silicon Wafer

23614.

Jcr0150b 4-Inch SCR Chips Diced Silicon Wafer Open Details in New Window [Dec 09, 2020]

Die Size 1500μ m×1500μ m Size of Bonding Pad Controlling 260μ m×260μ m Cathode: 920×920×3/4µm2 Thickness 220±20μm Scribe Width 90μm Metallization ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

P1.8 4-Inch Power Transistor Chips Diced Silicon Wafer

23615.

P1.8 4-Inch Power Transistor Chips Diced Silicon Wafer Open Details in New Window [Dec 09, 2020]

Die Size 1780μ m×1780μ m Size of Bonding Pad Base 495μ m×495μ m Emitter 495μ m×495μ m Thickness 240±10μm Scribe Width 80μm Metallization Front: Al ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

13009 4-Inch NPN High-Voltage Switching Transistor Diced Silicon Wafer

23616.

13009 4-Inch NPN High-Voltage Switching Transistor Diced Silicon Wafer Open Details in New Window [Dec 09, 2020]

Die Size 4.3mm×4.3mm Size of Bonding Pad Base 690*1000μm2 Emitter 825*1200μm2 Thickness 240±10μm Scribe Width 60μm Metallization Front: Al 4.3±0.3μm Front: Al ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

Bc817 High Frequency Small Signal Transistor Diced Silicon Wafer

23617.

Bc817 High Frequency Small Signal Transistor Diced Silicon Wafer Open Details in New Window [Dec 09, 2020]

Die Size 0.49mm×0.49mm BVCEO 45V IC 500A BVCBO/BVEBO 50V/6V hFE Min.:125 Max:600 Yangzhou Genesis Microelectronics Co., Ltd., a sino-foreign joint venture, is a national high-tech enterprise which was ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

882m 5-Inch Medium-Power Transistor Diced Silicon Wafer

23618.

882m 5-Inch Medium-Power Transistor Diced Silicon Wafer Open Details in New Window [Dec 09, 2020]

Die Size 1..08mm×1.08mm BVCEO 30V IC 3A BVCBO/BVEBO 30V/7V hFE Min.:100 Max:400 Yangzhou Genesis Microelectronics Co., Ltd., a sino-foreign joint venture, is a national high-tech enterprise which was ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

RoHS Compliant P-Channel Mosfet Application 2301 in a Sot-23 Package

23619.

RoHS Compliant P-Channel Mosfet Application 2301 in a Sot-23 Package Open Details in New Window [Mar 22, 2021]

Product Description Rohs Compliant P-Channel MOSFET application 2301 in a SOT-23 package Part Number 2301 VDSS -20V ID -3A RDS 48mΩ @ vgs=4.5V Vth -0.7V Package SOT-23 Ciss 405 pF Crss 55 pF ...

Company: Wuxi Goford Semiconductor Co., Ltd.

DC Motor Control Usage Power Mosfet Reel/Tube Packing

23620.

DC Motor Control Usage Power Mosfet Reel/Tube Packing Open Details in New Window [Mar 22, 2021]

Product Description DC motor control usage Power Mosfet Reel/Tube Packing Part Number 630A VDSS 200V ID 9A RDS 210 mΩ @ vgs=10V Vth 1.6V Package TO-251 Ciss 509 pF Crss 3.2 pF Datasheet ...

Company: Wuxi Goford Semiconductor Co., Ltd.

S45p60ayy 5-Inch Power Schottky Barrier Diode Chip/Silicon Wafer

23621.

S45p60ayy 5-Inch Power Schottky Barrier Diode Chip/Silicon Wafer Open Details in New Window [Dec 14, 2020]

Die Size 1.14mm×1.14mm IF 2A VR 40V IR 25μA VF 0.53V Tj 125ºC Wafer Size 5 inches Yangzhou Genesis Microelectronics Co., Ltd., a sino-foreign joint venture, is a national high-tech ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

Bj162 4-Inch Diode Wafer Bj162 Chip/Silicon Wafer

23622.

Bj162 4-Inch Diode Wafer Bj162 Chip/Silicon Wafer Open Details in New Window [Dec 14, 2020]

Die Size 1800μ m×1800μ m Size of Bonding Pad Base 296μ m×540μ m Emitter 300×700µm2 Thickness 240±10μm Scribe Width 40μm Metallization Front: Al Back: ...

Company: Yangzhou Genesis Microelectronics Co., Ltd.

Monocrystalline Silicon 8 Inch Storage Box

23623.

Monocrystalline Silicon 8 Inch Storage Box Open Details in New Window [Apr 06, 2023]

Description Visual Inspection Criteria Material Storage-Box is made of antistatic PP Scratch less than 3cm Defect Description criteria Broken/Damaged Free of Broken/Damaged Crack No ...

Company: Suzhou Henglixin New Material Co., Ltd.

Monocrystalline Silicon Needle

23624.

Monocrystalline Silicon Needle Open Details in New Window [Mar 22, 2023]

Description Certificate About Us Suzhou Henglixin New Materials Co., Ltd. is a professional and comprehensive service company for semiconductor wafers and silicon components solutions. we entered the ...

Company: Suzhou Henglixin New Material Co., Ltd.

1n5391 1n5392 1n5393 1n5395 1n5397 1n5398 1n5399 Rectifier Diode Modules

23625.

1n5391 1n5392 1n5393 1n5395 1n5397 1n5398 1n5399 Rectifier Diode Modules Open Details in New Window [Jan 07, 2022]

Quick Details Model Number: SS310(SS32~SS320) Type: Schottky Diode Place of Origin: Guangdong, China Brand Name: LCE Package Type: Surface Mount Max. Forward Voltage: 0.85V Max. Reverse ...

Company: Jiangsu Powerful Semiconductor Technology Co., Ltd.