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Sinker EDM /Spark Eroded Titanium Coating Tungsten Carbide Mold Dies for Semiconductor

18961.

Sinker EDM /Spark Eroded Titanium Coating Tungsten Carbide Mold Dies for Semiconductor Open Details in New Window [Sep 18, 2024]

Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...

Company: Wuxi Sundi Precision Tools Co., Ltd.

Sodick Sebu Wire-Cutting Mirror Surface CNC Machining Mold Part for Semiconductor Industry

18962.

Sodick Sebu Wire-Cutting Mirror Surface CNC Machining Mold Part for Semiconductor Industry Open Details in New Window [Sep 18, 2024]

Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...

Company: Wuxi Sundi Precision Tools Co., Ltd.

Semiconductor High Precision COB Smart Die Bonding Machine

18963.

Semiconductor High Precision COB Smart Die Bonding Machine Open Details in New Window [Oct 07, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Die Bonding Machine China Manufacturer

18964.

Semiconductor Die Bonding Machine China Manufacturer Open Details in New Window [Sep 27, 2023]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

No Bubble Quartz Glass Rod for Semiconductor Quartz Bar

18965.

No Bubble Quartz Glass Rod for Semiconductor Quartz Bar Open Details in New Window [Oct 18, 2025]

Product Description Product Name no bubble quartz glass rod for semiconductor quartz bar Color Clear Application 1.Laboratory equipment, 2.Optoelectronic communications 3.Chemistry, Machinery, Electric power, ...

Company: Lianyungang Telling Quartz Co., Ltd.

High End Die Bonder Equipment to Assist in Semiconductor Packaging

18966.

High End Die Bonder Equipment to Assist in Semiconductor Packaging Open Details in New Window [Dec 11, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Die Bonding Machine

18967.

Bozhon Semiconductor Die Bonding Machine Open Details in New Window [Oct 16, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Die Attach Epoxy Machine

18968.

Bozhon Semiconductor Die Attach Epoxy Machine Open Details in New Window [Sep 20, 2023]

Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Wafer Carrier95% 99% Alumina Ceramic Disk and Ceramic Edge Ring

18969.

Semiconductor Wafer Carrier95% 99% Alumina Ceramic Disk and Ceramic Edge Ring Open Details in New Window [Mar 11, 2025]

Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...

Company: Wuxi Sundi Precision Tools Co., Ltd.

Ts16949 Qualified OEM High Precision Parts Turning Milling Custom CNC Machining Service Accessories ...

18970.

Ts16949 Qualified OEM High Precision Parts Turning Milling Custom CNC Machining Service Accessories ... Open Details in New Window [Dec 04, 2024]

Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...

Company: Kunshan Chenyun Precision Machinery Co., Ltd.

Jiangsu Factory Milling Machine Brass Aluminium Steel Iron Machining CNC Lathe Precision Machining ...

18971.

Jiangsu Factory Milling Machine Brass Aluminium Steel Iron Machining CNC Lathe Precision Machining ... Open Details in New Window [Dec 04, 2024]

Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...

Company: Kunshan Chenyun Precision Machinery Co., Ltd.

Custom Made CNC Machining Milling Molding Zro2 Zirconium Oxide Ceramic Parts for Semiconductor ...

18972.

Custom Made CNC Machining Milling Molding Zro2 Zirconium Oxide Ceramic Parts for Semiconductor ... Open Details in New Window [Oct 07, 2024]

Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...

Company: Wuxi Sundi Precision Tools Co., Ltd.

High Precision Optical Profile Grinding Opg Progressive Die Metal Stamping Dambar Cutting Die for ...

18973.

High Precision Optical Profile Grinding Opg Progressive Die Metal Stamping Dambar Cutting Die for ... Open Details in New Window [Sep 18, 2024]

Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...

Company: Wuxi Sundi Precision Tools Co., Ltd.

Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ...

18974.

Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ... Open Details in New Window [Jan 25, 2024]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines

18975.

Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines Open Details in New Window [Jan 19, 2024]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...

Company: Suzhou Bozhon Semiconductor Co., Ltd