Jiangsu Profile
Product List
18961. Automatic Optical Defect Inspection Equipment for Semiconductor Back-End Packaging 
[Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18962. Fully Automatic 3D Optical Inspection Equipment for Semiconductor Packaging [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18963. Bozhon Semiconductor Leadscan Aoi/AVI Inspection Equipment [Nov 27, 2023]
[Nov 27, 2023] Product Description The IR9821 inspector provides Increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of defects that affect final ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18964. Semiconductor Chip Placement Equipment High-Precision Dispensing Machine [Nov 22, 2023]
[Nov 22, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18965. Power Semiconductor High-Precision Die Bonding Equipment [Nov 20, 2023]
[Nov 20, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18966. Semiconductor Back-End Packaging and Bonding Placement Equipment [Nov 17, 2023]
[Nov 17, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18967. Bozhon Semiconductor Die Bonding Machine China Equipment [Oct 09, 2023]
[Oct 09, 2023] Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18968. Submikron Semiconductor Die Bonding & Die Solder Machines [Oct 09, 2023]
[Oct 09, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18969. Stainless Steel Aluminium Alloy Semiconductor Cooler Parts Liquid Cold Plate Heat Exchanger [Jul 17, 2025]
[Jul 17, 2025] Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...
Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd
18970. Stainless Steel Alloy Precision Semiconductor Cooler Parts Customization Plate Heat Exchanger [Jul 17, 2025]
[Jul 17, 2025] Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...
Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd
18971. SUS316 Precision Parts Customization Plate Cooler Heat Exchanger for Semiconductor Industry [Jul 17, 2025]
[Jul 17, 2025] Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...
Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd
18972. Aluminum Alloy Vacuum Welding Plate Heat Exchanger for Auto Photovoltaic Semiconductor Industry [Jul 16, 2025]
[Jul 16, 2025] Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...
Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd
18973. 304/316ss Machining Welding Vacuum Spiral Tube Cooler for Semiconductor Heat Exchanging [Jul 15, 2025]
[Jul 15, 2025] Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Application Our ...
Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd
18974. Mirror Polishing Stainless Steel Welding Parts Spiral Tube Heat Exchanger for Semiconductor [Jul 15, 2025]
[Jul 15, 2025] Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Application Our ...
Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd
18975. Progressive Die Metal Stamping Small Teeth Tungsten Carbide Forming Dambar Punch for Semiconductor ... [Sep 29, 2024]
[Sep 29, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
