Jiangsu Profile
Product List
18961. Sinker EDM /Spark Eroded Titanium Coating Tungsten Carbide Mold Dies for Semiconductor 
[Sep 18, 2024]
[Sep 18, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18962. Sodick Sebu Wire-Cutting Mirror Surface CNC Machining Mold Part for Semiconductor Industry [Sep 18, 2024]
[Sep 18, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18963. Semiconductor High Precision COB Smart Die Bonding Machine [Oct 07, 2023]
[Oct 07, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18964. Semiconductor Die Bonding Machine China Manufacturer [Sep 27, 2023]
[Sep 27, 2023] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18965. No Bubble Quartz Glass Rod for Semiconductor Quartz Bar [Oct 18, 2025]
[Oct 18, 2025] Product Description Product Name no bubble quartz glass rod for semiconductor quartz bar Color Clear Application 1.Laboratory equipment, 2.Optoelectronic communications 3.Chemistry, Machinery, Electric power, ...
Company: Lianyungang Telling Quartz Co., Ltd.
18966. High End Die Bonder Equipment to Assist in Semiconductor Packaging [Dec 11, 2023]
[Dec 11, 2023] Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18967. Bozhon Semiconductor Die Bonding Machine [Oct 16, 2023]
[Oct 16, 2023] Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18968. Bozhon Semiconductor Die Attach Epoxy Machine [Sep 20, 2023]
[Sep 20, 2023] Product Description The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products. Detailed Photos High Precision: ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18969. Semiconductor Wafer Carrier95% 99% Alumina Ceramic Disk and Ceramic Edge Ring [Mar 11, 2025]
[Mar 11, 2025] Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18970. Ts16949 Qualified OEM High Precision Parts Turning Milling Custom CNC Machining Service Accessories ... [Dec 04, 2024]
[Dec 04, 2024] Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...
18971. Jiangsu Factory Milling Machine Brass Aluminium Steel Iron Machining CNC Lathe Precision Machining ... [Dec 04, 2024]
[Dec 04, 2024] Product Description Material Stainless Steel/brass/brone/aluminimu/ Process Maching/milling/turing/cnc center/surfacetreatment Surface treatment Anodized, Black Oxide, Chrome Plating, etc Product ...
18972. Custom Made CNC Machining Milling Molding Zro2 Zirconium Oxide Ceramic Parts for Semiconductor ... [Oct 07, 2024]
[Oct 07, 2024] Product Description Features of Our Ceramic Parts 1 Quick production as fast as 3 day On average, we return quotations within 24 hours.We are good at manufacturing various highly qualified ceramic parts(Al2O3, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18973. High Precision Optical Profile Grinding Opg Progressive Die Metal Stamping Dambar Cutting Die for ... [Sep 18, 2024]
[Sep 18, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...
Company: Wuxi Sundi Precision Tools Co., Ltd.
18974. Micron Level Mounting Accuracy of Domestically Produced Semiconductor Chip Eutectic Machine ... [Jan 25, 2024]
[Jan 25, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
18975. Application of Coc&COB&Cos Mounting in Domestic High-Precision Semiconductor Eutectic Machines [Jan 19, 2024]
[Jan 19, 2024] Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...
Company: Suzhou Bozhon Semiconductor Co., Ltd
