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Semiconductor Chip Placement Equipment High-Precision Dispensing Machine

18031.

Semiconductor Chip Placement Equipment High-Precision Dispensing Machine Open Details in New Window [Nov 22, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Power Semiconductor High-Precision Die Bonding Equipment

18032.

Power Semiconductor High-Precision Die Bonding Equipment Open Details in New Window [Nov 20, 2023]

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Semiconductor Back-End Packaging and Bonding Placement Equipment

18033.

Semiconductor Back-End Packaging and Bonding Placement Equipment Open Details in New Window [Nov 17, 2023]

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Bozhon Semiconductor Die Bonding Machine China Equipment

18034.

Bozhon Semiconductor Die Bonding Machine China Equipment Open Details in New Window [Oct 09, 2023]

Product Description The EG9921 is a fully automatic sub-micron SMT machine. Its unique laser heating technology can heat the top of the substrate in a small area, achieving rapid heating of the part surface and ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Submikron Semiconductor Die Bonding & Die Solder Machines

18035.

Submikron Semiconductor Die Bonding & Die Solder Machines Open Details in New Window [Oct 09, 2023]

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High ...

Company: Suzhou Bozhon Semiconductor Co., Ltd

Stainless Steel Aluminium Alloy Semiconductor Cooler Parts Liquid Cold Plate Heat Exchanger

18036.

Stainless Steel Aluminium Alloy Semiconductor Cooler Parts Liquid Cold Plate Heat Exchanger Open Details in New Window [Jul 17, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd

Stainless Steel Alloy Precision Semiconductor Cooler Parts Customization Plate Heat Exchanger

18037.

Stainless Steel Alloy Precision Semiconductor Cooler Parts Customization Plate Heat Exchanger Open Details in New Window [Jul 17, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd

SUS316 Precision Parts Customization Plate Cooler Heat Exchanger for Semiconductor Industry

18038.

SUS316 Precision Parts Customization Plate Cooler Heat Exchanger for Semiconductor Industry Open Details in New Window [Jul 17, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd

Aluminum Alloy Vacuum Welding Plate Heat Exchanger for Auto Photovoltaic Semiconductor Industry

18039.

Aluminum Alloy Vacuum Welding Plate Heat Exchanger for Auto Photovoltaic Semiconductor Industry Open Details in New Window [Jul 16, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Our Advantages ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd

304/316ss Machining Welding Vacuum Spiral Tube Cooler for Semiconductor Heat Exchanging

18040.

304/316ss Machining Welding Vacuum Spiral Tube Cooler for Semiconductor Heat Exchanging Open Details in New Window [Jul 15, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Application Our ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd

Mirror Polishing Stainless Steel Welding Parts Spiral Tube Heat Exchanger for Semiconductor

18041.

Mirror Polishing Stainless Steel Welding Parts Spiral Tube Heat Exchanger for Semiconductor Open Details in New Window [Jul 15, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos Application Our ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd

High Efficiency Psa Nitrogen Generation Unit Complete System High Purity for Industrial ...

18042.

High Efficiency Psa Nitrogen Generation Unit Complete System High Purity for Industrial ... Open Details in New Window [May 20, 2025]

Product Description Purity: 90%-93% Capacity: 200~20000Nm3/h Pressure: Normal 0.4Mpa Energy for Consumption Oxygen:0.36~0.42KWh/Nm The VPSA precess is similar with PSA. VPSA oxygen generator use air ...

Company: Nanjing Bangwin Gas Equipment Co., Ltd.

Factory Direct Sales 150L/H Liquid Nitrogen Plant PLC Liquid Nitrogen Plant for Manufacturing ...

18043.

Factory Direct Sales 150L/H Liquid Nitrogen Plant PLC Liquid Nitrogen Plant for Manufacturing ... Open Details in New Window [May 20, 2025]

Product Description Product name Air Separation Plant Technology Cryogenic Brand name Bangwin Oxygen Purity ≥99.6% Oxygen Output 50,80,180,260,350,550,750,1200 Nm3/h Nitrogen ...

Company: Nanjing Bangwin Gas Equipment Co., Ltd.

Progressive Die Metal Stamping Small Teeth Tungsten Carbide Forming Dambar Punch for Semiconductor ...

18044.

Progressive Die Metal Stamping Small Teeth Tungsten Carbide Forming Dambar Punch for Semiconductor ... Open Details in New Window [Sep 29, 2024]

Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear resistance, ...

Company: Wuxi Sundi Precision Tools Co., Ltd.

Metal Alloy CNC Machining Welding Vacuum Semiconductor Parts with Professional Drawings ...

18045.

Metal Alloy CNC Machining Welding Vacuum Semiconductor Parts with Professional Drawings ... Open Details in New Window [Jul 14, 2025]

Hicent proficient in CNC machining. We provide OEM and ODM service with high quality raw material, high precision, 100% inspection, fast delivery, and best service. Detailed Photos ...

Company: Wuxi Cummins Precision Machinery Manufacturing Co., Ltd