Jiangsu Profile
Product List
16186. Precision Machining 304 Steel 316 CNC Part Auto Spare Parts Turning Parts Semiconductor Parts 
[Dec 15, 2025]
[Dec 15, 2025] Product Description Product Parameters Part Details (CNC Turning) Material Titanium, Aluminum, Stainless Steel, Copper/Brass, Iron, any types of alloy Machine 3 / 4 /5 axis CNC Machining ...
Company: Suzhou Yishihan Electromechanical Technology Co., Ltd.
16187. Precision Turning Machining 304 Steel 316 CNC Part Semiconductor Parts Spare Parts Turning Milling ... [Dec 15, 2025]
[Dec 15, 2025] Product Description Product Parameters Part Details (CNC Turning) Material Titanium, Aluminum, Stainless Steel, Copper/Brass, Iron, any types of alloy Machine 3 / 4 /5 axis CNC Machining ...
Company: Suzhou Yishihan Electromechanical Technology Co., Ltd.
16188. Customized High Quality Metal Precision CNC Milling Parts Semiconductor Parts CNC Machining Parts [Dec 11, 2025]
[Dec 11, 2025] Product Description Product Parameters Part Details (CNC Milling) Material Titanium, Aluminum, Stainless Steel, Copper/Brass, Iron, any types of alloy Machine 3 / 4 /5 axis CNC Machining ...
Company: Suzhou Yishihan Electromechanical Technology Co., Ltd.
16189. 1000A High Accuracy Closed-Loop Current Transducer High Precision Hall Sensor [Sep 15, 2025]
[Sep 15, 2025] Features: - Closed-loop transducer using the Hall effect - Using insulated enclosures that comply with - UL94V-0 standard - Good linearity, Broadband - Optimized response time - No insertion losses - Strong ...
16190. High Precision 800A AC/DC Current Transducer Closed Loop Hall Effect [Sep 15, 2025]
[Sep 15, 2025] Features: - Closed-loop transducer using the Hall effect - Using insulated enclosures that comply with - UL94V-0 standard - Good linearity, Broadband - Optimized response time - No insertion losses - Strong ...
16191. Automatic Flange Hole Punching Machine for Ventilation, Semiconductor and Firefighting Purpose [Aug 19, 2025]
[Aug 19, 2025] Automatic Flange Hole Punching Machine Our high-performance Automatic Flange Hole Punching Machine uses to punch two holes one time on fan flange in one time. It has multi-mode operations, can be manual, semi-automatic ...
Company: Nantong Zhenhuan Trade Co., Ltd.
16192. Black Anodized OEM Aluminum Extrusion Heat Sink Profiles for High Power Semiconductor Electronics ... [Aug 14, 2025]
[Aug 14, 2025] Champagne Anodized OEM Aluminum Extrusin Heat Sink Profiles For High Power Semiconductor Electronics Fanless Heatsink Product Description Aluminum heat sink extrusion is the most common process and cost efficient ...
16193. Electrophoresis Anti Scratch Durable Aluminum Extrusion Profiles for High Power Semiconductor ... [Aug 14, 2025]
[Aug 14, 2025] Electrophoresis Anti Scratch Durable Aluminum Extrusion Profiles For High Power Semiconductor Electronics Fanless Heatsink Product Description Aluminum heat sink extrusion is the most common process and cost ...
16194. High Purity Granules Semiconductor Wafer Clamps Metal Free Peek [Jul 16, 2025]
[Jul 16, 2025] Product Description Polyetheretherketone (PEEK): Material Overview Material Characteristics PEEK (Polyetheretherketone) is a high-performance thermoplastic polymer renowned for its exceptional mechanical, ...
Company: Suzhou Furenxiang Trade Co., Ltd.
16195. Custom Precision Optical Profile Grinding Pg Small Slots Tungsten Carbide Dies for Semiconductor ... [Aug 23, 2024]
[Aug 23, 2024] Product Description Material Selection of Mold Accessories /Wear Resistance Material Characteristics Hardness Range Parts Tolerance High-Speed Steel(M2,1.3343,EM2,SKH51) Excellent wear ...
Company: Wuxi Sundi Precision Tools Co., Ltd
16196. Manufacturer Precision Mirro-Polished Zirconia Oxide Silicone Nitride Aluminum Ceramic Products for ... [Aug 31, 2023]
[Aug 31, 2023] Company Profile Product Description Content Unit AL2O3 ZrO2 SiC Si3N4 Property 95%AL2O3 99%AL2O3 ZrO2 ZrO2 ZrO2 Mechanical Characteristics Color black faint ...
Company: Wuxi Sundi Precision Tools Co., Ltd
16197. Advanced Vertical Wafer Drying System for Semiconductor Manufacturing [Oct 09, 2026]
[Oct 09, 2026] Product Description A.Equipment overview 1.1 Application Fields: It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, ...
16198. Advanced High-Speed Die Bonder for Semiconductor Production Efficiency [Oct 09, 2026]
[Oct 09, 2026] High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method ...
16199. Titanium Tetrachloride TiCl4 Semiconductor Grade Chemical and Precursor [Oct 20, 2026]
[Oct 20, 2026] Product Description Product Description Product Name: Titanium(IV) chloride Other Names: Titanium tetrachloride; Titanium(IV) chloride solution; Titaniumchloridemin; Titanium; titanium(4+) tetrachloride; Titanium ...
16200. Semiconductor Cleanroom Pass Box with ESD-Safe Design for Wafer Transfer [Oct 21, 2026]
[Oct 21, 2026] Product Introduction Transfer Window It is mainly used for the transfer of items between the clean area and the flying clean area to reduce the number of doors in the clean room and prevent external air pollution of the ...
Company: Suzhou Yong Tai Yi Purification Technology Co., Ltd.
