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Automatic Metal Deburring Machine for Sheet Edge Rounding and Burr Removal
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12421.

Automatic Metal Deburring Machine for Sheet Edge Rounding and Burr Removal Open Details in New Window [Sep 11, 2026]

Product Description SGP1300 DEBURRING, EDGE ROUNDING, AND SURFACE FINISHING MACHINE FOR LASER CUTTING PARTS SGP1300 is a wide belt grinding and planet type deburring machine which is mainly applied in fabrication ...

Company: NANJING JSC TRADING COMPANY LIMITED

Automatic Sheet Deburring Machine for Metal Burr Removal and Edge Rounding
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12422.

Automatic Sheet Deburring Machine for Metal Burr Removal and Edge Rounding Open Details in New Window [Sep 10, 2026]

Product Description SGP1300 DEBURRING, EDGE ROUNDING, AND SURFACE FINISHING MACHINE FOR LASER CUTTING PARTS SGP1300 is a wide belt grinding and planet type deburring machine which is mainly applied in fabrication ...

Company: NANJING JSC TRADING COMPANY LIMITED

IC Wafer Grinding Machine for Semiconductor Manufacturing
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12423.

IC Wafer Grinding Machine for Semiconductor Manufacturing Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Silicon Wafer Surface Grinding Machine for Semiconductor Fab
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12424.

Silicon Wafer Surface Grinding Machine for Semiconductor Fab Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Grinding Machine for IC Chip
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12425.

Semiconductor Silicon Wafer Grinding Machine for IC Chip Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

IC Silicon Wafer Grinding Machine High Flatness
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12426.

IC Silicon Wafer Grinding Machine High Flatness Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Wafer Grinding Machine for Clean Surface
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12427.

Semiconductor Wafer Grinding Machine for Clean Surface Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

IC Wafer Surface Grinding Machine for Precision Processing
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12428.

IC Wafer Surface Grinding Machine for Precision Processing Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Wafer Grinding Machine for Ultra Thin Wafer
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12429.

Semiconductor Wafer Grinding Machine for Ultra Thin Wafer Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Silicon Wafer Back Grinding Machine for Semiconductor Use
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12430.

Silicon Wafer Back Grinding Machine for Semiconductor Use Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Silicon Wafer Grinding Machine for Microelectronics Industry
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12431.

Silicon Wafer Grinding Machine for Microelectronics Industry Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

IC Silicon Wafer Grinding Machine for Thickness Control
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12432.

IC Silicon Wafer Grinding Machine for Thickness Control Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Silicon Wafer Surface Grinding Machine CNC
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12433.

Semiconductor Silicon Wafer Surface Grinding Machine CNC Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

Semiconductor Wafer Grinding Machine for Silicon Processing Line
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12434.

Semiconductor Wafer Grinding Machine for Silicon Processing Line Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.

IC Wafer Grinding Machine High Precision for Semiconductor
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12435.

IC Wafer Grinding Machine High Precision for Semiconductor Open Details in New Window [Apr 25, 2026]

Production process Can build a complete silicon wafer production line Equipment Features 1. Driven by an AC variable frequency motor, with soft start and soft stop, ensuring smooth and reliable operation. 2. The ...

Company: Nanjing Bangwin Thermal Equipment Co., Ltd.